B24B 37/013
Devices or means for detecting lapping completion
B24B37/013 (Devices or means for detecting lapping completion) appears on 1,314 US grants and 1,136 published applications in this corpus.
Search patents in B24B- Granted patents
- 1,314
- Published applications
- 1,136
- Assignees
- 266
- Inventors
- 1,817
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 4 | 0 |
| 1988 | 5 | 0 |
| 1989 | 3 | 0 |
| 1990 | 5 | 0 |
| 1991 | 4 | 0 |
| 1992 | 8 | 0 |
| 1993 | 15 | 0 |
| 1994 | 10 | 0 |
| 1995 | 21 | 0 |
| 1996 | 16 | 0 |
| 1997 | 32 | 0 |
| 1998 | 38 | 0 |
| 1999 | 47 | 0 |
| 2000 | 54 | 0 |
| 2001 | 84 | 41 |
| 2002 | 72 | 75 |
| 2003 | 101 | 82 |
| 2004 | 63 | 58 |
| 2005 | 63 | 54 |
| 2006 | 66 | 52 |
| 2007 | 49 | 45 |
| 2008 | 22 | 33 |
| 2009 | 29 | 30 |
| 2010 | 28 | 35 |
| 2011 | 20 | 30 |
| 2012 | 20 | 36 |
| 2013 | 33 | 40 |
| 2014 | 35 | 52 |
| 2015 | 39 | 49 |
| 2016 | 43 | 24 |
| 2017 | 34 | 24 |
| 2018 | 21 | 28 |
| 2019 | 24 | 54 |
| 2020 | 27 | 31 |
| 2021 | 20 | 36 |
| 2022 | 24 | 42 |
| 2023 | 46 | 47 |
| 2024 | 35 | 55 |
| 2025 | 29 | 37 |
| 2026 | 21 | 46 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Optical thickness control during a chemical mechanical polishing process and apparatus for effecting the same6 Oct 2026US 12,752,390 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Polishing pad, polishing apparatus, and polishing method22 Sep 2026US 12,741,354 B2Ebara Corporation
- Polishing apparatus1 Sep 2026US 12,722,244 B2Ebara Corporation
- Acoustic carrier head monitoring18 Aug 2026US 12,708,978 B2APPLIED Materials.Inc.
- Method for detection of wafer slippage11 Aug 2026US 12,703,057 B2APPLIED Materials.Inc.
- Polishing method, polishing apparatus, and computer-readable storage medium8 Oct 2026US 2026/0307201 A1Ebara Corporation
- Polishing method, polishing monitoring method and polishing monitoring apparatus for workpiece1 Oct 2026US 2026/0295767 A1Ebara Corporation
- Polishing method and polishing apparatus1 Oct 2026US 2026/0305264 A1Ebara Corporation
- Polishing apparatus and method for creating film thickness profile in polishing apparatus24 Sep 2026US 2026/0284825 A1Ebara Corporation
- Polishing method, polishing monitoring method and polishing monitoring apparatus for workpiece24 Sep 2026US 2026/0284826 A1Ebara Corporation
Most cited
By later US patents
- Plasma monitoring and control method and system625US 5,576,629 AFourth State Technology, Inc. · 1996
- Plasma monitoring and control method and system503US 5,939,886 AAdvanced Energy Industries, Inc. · 1999
- Indirect endpoint detection by chemical reaction and chemiluminescence486US 6,126,848 AInternational Business Machines Corporation · 2000
- Apparatus and method for determining wafer temperature using pyrometry475US 5,305,417 ATexas Instruments Incorporated · 1994
- In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing472US 5,433,651 AInternational Business Machines Corporation · 1995