Substrate polishing apparatus
AssigneeKctech Co., Ltd.
InventorsSung Ho Shin, Hee Cheul Jung, Soo Ho Kim
Life of this patent
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Abstract
Provided is a substrate polishing apparatus. The substrate polishing apparatus includes a carrier configured to grip a substrate, a polishing pad configured to polish a surface to be polished of the substrate gripped by the carrier while rotating, and a temperature control assembly configured to control a temperature of the polishing pad, and the temperature control assembly includes Deionized water (DIW) spraying module configured to spray DIW toward the polishing pad and a guide vane configured to guide at least a portion of the DIW sprayed from the DIW spraying module to an outside of the polishing pad.
Claims9
A substrate polishing apparatus comprising:
- a carrier configured to grip a substrate;
- a polishing pad configured to polish a surface to be polished of the substrate gripped by the carrier while rotating;
- and
- a temperature control assembly configured to control a temperature of the polishing pad,
- wherein the temperature control assembly comprises:
- a Deionized water (DIW) spraying module configured to spray DIW toward the polishing pad;
- and
- a guide vane configured to guide at least a portion of the DIW sprayed from the DIW spraying module to an outside of the polishing pad;
- a slurry spraying module configured to spray slurry toward the polishing pad;
- and
- a housing configured to accommodate the DIW spraying module and the slurry spraying module and to which one end portion of the guide vane is coupled.
Dependencies are inferred from the claim text.