B24B 37/015
Temperature control
B24B37/015 (Temperature control) appears on 221 US grants and 294 published applications in this corpus.
Search patents in B24B- Granted patents
- 221
- Published applications
- 294
- Assignees
- 91
- Inventors
- 604
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 8 | 0 |
| 1998 | 9 | 0 |
| 1999 | 7 | 0 |
| 2000 | 6 | 0 |
| 2001 | 8 | 5 |
| 2002 | 9 | 7 |
| 2003 | 3 | 5 |
| 2004 | 7 | 4 |
| 2005 | 3 | 6 |
| 2006 | 7 | 4 |
| 2007 | 3 | 3 |
| 2008 | 1 | 5 |
| 2009 | 2 | 2 |
| 2010 | 1 | 10 |
| 2011 | 2 | 3 |
| 2012 | 5 | 8 |
| 2013 | 5 | 5 |
| 2014 | 2 | 4 |
| 2015 | 6 | 13 |
| 2016 | 4 | 6 |
| 2017 | 6 | 8 |
| 2018 | 10 | 11 |
| 2019 | 7 | 20 |
| 2020 | 11 | 24 |
| 2021 | 6 | 27 |
| 2022 | 8 | 22 |
| 2023 | 23 | 24 |
| 2024 | 22 | 25 |
| 2025 | 13 | 31 |
| 2026 | 10 | 12 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Substrate polishing apparatus6 Oct 2026US 12,752,391 B2Kctech Co., Ltd.
- Polishing method for gallium nitride wafer6 Oct 2026US 12,757,663 B2Disco Corporation
- Chemical mechanical polishing temperature scanning apparatus for temperature control14 Jul 2026US 12,678,912 B2APPLIED Materials.Inc.
- Processing apparatus16 Jun 2026US 12,654,279 B2Disco Corporation
- Method of creating correlation relational formula for determining polishing condition, method of determining polishing condition, and semiconductor wafer manufacturing method5 May 2026US 12,617,057 B2Sumco Corporation
- Chemical mechanical polishing temperature scanning apparatus for temperature control8 Oct 2026US 2026/0307202 A1APPLIED Materials.Inc.
- Substrate polishing system23 Jul 2026US 2026/0208317 A1Samsung Electronics Co., Ltd.
- Wafer polishing device16 Jul 2026US 2026/0200035 A1Samsung Electronics Co., Ltd.
- Cmp polishing pad with phase changing materials21 May 2026US 2026/0138231 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Double-side polishing apparatus for workpiece and double-side polishing method for workpiece14 May 2026US 2026/0131416 A1Sumco Corporation
Most cited
By later US patents
- System for real-time control of semiconductor wafer polishing including optical monitoring282US 5,658,183 AMicron Technology, Inc. · 1997
- System for real-time control of semiconductor wafer polishing including optical montoring249US 5,730,642 AMicron Technology, Inc. · 1998
- System for real-time control of semiconductor wafer polishing186US 5,851,135 AMicron Technology, Inc. · 1998
- Wafer flood polishing176US 4,910,155 AInternational Business Machines Corporation · 1990
- System for real-time control of semiconductor wafer polishing160US 5,700,180 AMicron Technology, Inc. · 1997