Substrate polishing system

A substrate polishing system, comprising:

• an index module having a load port configured to support wafer carriers, each of the wafer carriers configured to support a plurality of wafers, and an index chamber configured to load and unload the plurality of wafers;
• a transfer chamber extending in a first direction from a first side of the index module and having a transfer robot that is movable along the first direction;
• a plurality of polishing units sequentially arranged in the first direction along a first side of the transfer chamber;
• and
• a plurality of cleaning units sequentially arranged in the first direction along a second side of the transfer chamber opposite to the first side,
• wherein each polishing unit of the plurality of polishing units includes vertically stacked polishing chambers stacked in multiple stages, and the vertically stacked polishing chambers include a rough polishing chamber and a fine polishing chamber, and
• wherein each cleaning unit of the plurality of cleaning units includes vertically stacked cleaning chambers stacked in multiple stages.

A substrate polishing system, comprising:

• a transfer chamber extending in a first direction, the transfer chamber having a first end configured to receive wafers;
• a plurality of polishing units arranged sequentially in the first direction along a first side of the transfer chamber;
• a plurality of cleaning units arranged sequentially in the first direction along a second side of the transfer chamber opposite to the first side;
• and
• a transfer robot within the transfer chamber movable in the first direction and along a vertical transfer path, the transfer robot configured to transfer the wafers between the first end of the transfer chamber, the plurality of polishing units, and the plurality of cleaning units,
• wherein each polishing unit of the plurality of polishing units includes vertically stacked polishing chambers that are stacked in multiple stages, and the vertically stacked polishing chambers include a rough polishing chamber and a fine polishing chamber that is stacked on the rough polishing chamber, and
• wherein each cleaning unit of the plurality of cleaning units includes vertically stacked cleaning chambers that are stacked in multiple stages.