Cmp polishing pad with phase changing materials
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorHsun-Hao Hsu
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Abstract
A chemical mechanical polishing (CMP) polishing pad used by a CMP system is provided. The CMP polishing pad comprises: a pad body comprising a base portion and an interfacing portion disposed on the base portion; and a phase-change material (PCM) embedded in the pad body, wherein the PCM is characterized by a melting temperature within an operational temperature range of a CMP process conducted by the CMP system.
Claims20
A chemical mechanical polishing (CMP) polishing pad used by a CMP system, the CMP polishing pad comprising:
- a pad body comprising:
- a base portion;
- and
- an interfacing portion disposed on the base portion;
- and
- a phase-change material (PCM) embedded in the pad body, wherein the PCM is characterized by a melting temperature within an operational temperature range of a CMP process conducted by the CMP system.
A method for making a chemical mechanical polishing (CMP) polishing pad used by a CMP system, the method comprising:
- adding polymers or polymer precursors and a phase-change material (PCM) to solvents;
- curing the solvent to obtain a CMP polishing pad chunk;
- skiving the CMP polishing pad chunk into a plurality of slices;
- and
- milling the plurality of slices to create a plurality of grooves on each slice.
A method for making a chemical mechanical polishing (CMP) polishing pad used by a CMP system, the method comprising:
- adding polymers or polymer precursors to solvents to obtain a mixture;
- curing the mixture to obtain a CMP polishing pad chunk;
- skiving the CMP polishing pad chunk into a plurality of slices comprising a first slice;
- depositing a phase-change material (PCM) layer on a top surface of the first slice;
- encapsulating the PCM layer by a cover plate to form a pad body comprising the first slice and the cover plate;
- and
- milling the pad body to create a plurality of grooves on the pad body.
Dependencies are inferred from the claim text.