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US 2025/0118604 A1Published application
Substrate polishing apparatus and substrate polishing method
AssigneeEbara Corporation
InventorsAkira FUKUNAGA, Katsuhide WATANABE, Itsuki KOBATA, Manabu TSUJIMURA
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Abstract
To planarize a substrate having irregularities on its surface. Provided is a method of chemical mechanical polishing of a substrate. The method includes the step of polishing the substrate using a processing solution, and the step of changing concentration of an effective component in the processing solution, which contributes to the polishing of the substrate.
Claims3
A method of chemical mechanical polishing of a substrate, comprising the steps of:
- polishing the substrate using a processing solution, and
- changing temperature of the processing solution during the polishing of the substrate.
A method of chemical mechanical polishing of a plurality of substrates of the same kind, comprising the steps of:
- polishing a first substrate using a first processing solution, and
- polishing a second substrate using a second processing solution
- wherein the second processing solution differs from the first processing solution in concentration of an effective component contained in the processing solution, which contributes to the polishing of the substrate.
Dependencies are inferred from the claim text.