Polishing slurry and method for chemical-mechanical polishing
AssigneeMicron Technology, Inc.
InventorsJames J. Alwan, Craig M. Carpenter
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Abstract
A method for polishing a grid of a field emission display (FED) with a polishing slurry contain very small particle of colloidal particles of amorphous silica in an alkaline medium. The method results in highly selective planarization well-suited for chemical-mechanical polishing (CMP) of the grid for the self-aligned CMP-FED fabrication process. An FED grid made according to this method is also disclosed.
Claims11
A method for chemical-mechanical polishing of a field emission display grid, comprising polishing said grid with an aqueous polishing slurry containing 20% to 50% by weight colloidal particles of amorphous silica having an average diameter ranging from about 12 nm to about 50 nm, and a sufficient amount of an alkaline compound to such that the pH of said slurry is above about 9.5.
A method for chemical-mechanical polishing of a field emission display grid, comprising polishing said grid with an aqueous polishing slurry containing about 30% by weight colloidal particles of amorphous silica having an average diameter of about 25 nm, an ammonium ion stabilizer, and a sufficient amount of an alkaline compound such that the pH of said slurry ranges from 9.5-11.0.
Dependencies are inferred from the claim text.