B23K 1/00
Soldering
Official title: Soldering, e.g. brazing, or unsoldering (B23K3/00 takes precedence)
B23K1/00 (Soldering) appears on 6,160 US grants and 5,979 published applications in this corpus.
Search patents in B23K- Granted patents
- 6,160
- Published applications
- 5,979
- Assignees
- 2,485
- Inventors
- 13,415
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 61 | 0 |
| 1977 | 38 | 0 |
| 1978 | 32 | 0 |
| 1979 | 26 | 0 |
| 1980 | 50 | 0 |
| 1981 | 29 | 0 |
| 1982 | 36 | 0 |
| 1983 | 37 | 0 |
| 1984 | 44 | 0 |
| 1985 | 57 | 0 |
| 1986 | 68 | 0 |
| 1987 | 82 | 0 |
| 1988 | 78 | 0 |
| 1989 | 76 | 0 |
| 1990 | 69 | 0 |
| 1991 | 85 | 0 |
| 1992 | 94 | 0 |
| 1993 | 96 | 0 |
| 1994 | 96 | 0 |
| 1995 | 89 | 0 |
| 1996 | 95 | 0 |
| 1997 | 83 | 0 |
| 1998 | 90 | 0 |
| 1999 | 91 | 0 |
| 2000 | 139 | 0 |
| 2001 | 134 | 54 |
| 2002 | 128 | 118 |
| 2003 | 128 | 145 |
| 2004 | 133 | 178 |
| 2005 | 99 | 164 |
| 2006 | 75 | 169 |
| 2007 | 69 | 151 |
| 2008 | 83 | 165 |
| 2009 | 67 | 225 |
| 2010 | 126 | 178 |
| 2011 | 109 | 212 |
| 2012 | 142 | 196 |
| 2013 | 144 | 257 |
| 2014 | 147 | 261 |
| 2015 | 218 | 443 |
| 2016 | 228 | 380 |
| 2017 | 322 | 402 |
| 2018 | 276 | 318 |
| 2019 | 285 | 317 |
| 2020 | 285 | 298 |
| 2021 | 225 | 252 |
| 2022 | 223 | 275 |
| 2023 | 224 | 257 |
| 2024 | 214 | 240 |
| 2025 | 186 | 207 |
| 2026 | 149 | 117 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- B23K 1/0008Soldering: specially adapted for particular articles or work3,607
- B23K 1/20Preliminary treatment of work or areas to be soldered1,241
- B23K 1/008Soldering within a furnace847
- B23K 1/19Taking account of the properties of the materials to be soldered832
- B23K 1/005Soldering by means of radiant energy628
- B23K 1/012Soldering with the use of hot gas391
- B23K 1/018Unsoldering365
- B23K 1/08Soldering by means of dipping in molten solder335
All 14 subgroupsShow fewer
Recent patents
- Manufacturing method for heat exchanger6 Oct 2026US 12,752,357 B2Daikin Industries, Ltd.
- Pin brazed mounting arrangement6 Oct 2026US 12,752,359 B1Tractian Technologies Inc
- Solder bump forming member, method for manufacturing solder bump forming member, and method for manufacturing electrode substrate provided with solder bump6 Oct 2026US 12,752,360 B2Resonac Corporation
- Bonding head and bonding apparatus6 Oct 2026US 12,752,380 B2Pac Tech—Packaging Technologies GmbH
- High-strength solder-plated Al—Mg—Si aluminum material6 Oct 2026US 12,753,475 B2Speira GmbH
- Vacuum adiabatic body and method for manufacturing the same8 Oct 2026US 2026/0309404 A1LG Electronics Inc.
- Improved cable connecting piece8 Oct 2026US 2026/0312306 A1Safetrack Infrasystems SISAB AB
- Method for joining dissimilar materials of titanium metal and solder for vacuum vessel sealing1 Oct 2026US 2026/0295703 A1Shijiazhuang Tiedao University
- Non-magnetization modification source-containing paste, non-magnetization device, rotor core, and method for manufacturing the same1 Oct 2026US 2026/0295736 A1Honda Motor Co., Ltd.
- Braze repair using metal coupon with porous region24 Sep 2026US 2026/0284808 A1GE Vernova Infrastructure Technology LLC
Most cited
By later US patents
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Light-beam heating apparatus352US 5,335,309 AMatsushita Electric Industrial Co., Ltd. · 1994
- Additive manufacturing of active devices using dielectric, conductive and magnetic materials323US 10,254,499 B1Southern Methodist University · 2019
- Cryogenic surgical instrument and method of manufacturing the same256US 5,573,532 ACryomedical Sciences, Inc. · 1996
- Method of mounting resilient contact structures to semiconductor devices254US 5,829,128 AFormFactor, Inc. · 1998