B23K 1/0002
Soldering by means of dipping in a fused salt bath
Official title: {Soldering by means of dipping in a fused salt bath}
B23K1/0002 (Soldering by means of dipping in a fused salt bath) appears on 8 US grants and 4 published applications in this corpus.
Search patents in B23K- Granted patents
- 8
- Published applications
- 4
- Assignees
- 8
- Inventors
- 19
- Latest grant
- 21 Nov 2023
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 1 |
| 2004 | 1 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 1 |
| 2018 | 0 | 1 |
| 2019 | 0 | 0 |
| 2020 | 0 | 1 |
| 2021 | 0 | 0 |
| 2022 | 0 | 0 |
| 2023 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Bonding member and bonding method21 Nov 2023US 11,819,915 B2Murata Manufacturing Co., Ltd.
- Method for continuous high-speed welding of double-ply metal tubes and welding furnace for performing the same26 Oct 2004US 6,808,103 B2
- Process for remelting a contact surface metallization8 Dec 1998US 5,845,838 AFraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V.
- Product for surface mount solder joints4 Apr 1995US 5,403,671 AMask Technology, Inc.
- Apparatus for forming surface mount solder joints7 Mar 1995US 5,395,040 AMask Technology, Inc.
- Method for producing a connection between two metallic components13 Feb 2020US 2020/0047289 A1Miba Sinter Austria GmbH
- Bonding member and bonding method8 Feb 2018US 2018/0036798 A1Murata Manufacturing Co., Ltd.
- Brazing titanium aluminum alloy components13 Jul 2017US 2017/0197270 A1ROLLS-ROYCE plc
- Method for continuous high-speed welding of double-ply metal tubes and welding furnace for performing the same23 Jan 2003US 2003/0015571 A1Yukito Nomura
Most cited
By later US patents
- Apparatus for forming surface mount solder joints27US 5,395,040 AMask Technology, Inc. · 1995
- Method of solder reflow assembly18US 4,334,646 AHarris Corporation · 1982
- Method for surface mount solder joints17US 5,310,574 AMask Technology, Inc. · 1994
- Product for surface mount solder joints15US 5,403,671 AMask Technology, Inc. · 1995
- Bonding member and bonding method2US 11,819,915 B2Murata Manufacturing Co., Ltd. · 2023