Process for remelting a contact surface metallization

A process for producing a contact bump by remelting a contact surface metallization applied to a substrate in an inert or reducing alcoholic medium whose boiling point is the same as or above the melting point of the contact surface metallization, wherein the medium is applied to the contact surface metallization applied to a contact surface of the substrate outside the inert or reducing medium in such a way that the contact surface metallization is screened with respect to the environment, and the medium is tempered to a temperature which is the same as or higher than the melting point of the contact surface metallization wherein the contact surface metallization is formed of at least two separate metallization components and the alloy formation takes place in alcoholic medium, wherein the boiling point of the medium is the same as or above the melting point of the forming allow of the metallization components.