B23K 1/008
Soldering within a furnace
Official title: Soldering within a furnace (B23K1/012 takes precedence)
B23K1/008 (Soldering within a furnace) appears on 847 US grants and 914 published applications in this corpus.
Search patents in B23K- Granted patents
- 847
- Published applications
- 914
- Assignees
- 508
- Inventors
- 2,185
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 5 | 0 |
| 1981 | 3 | 0 |
| 1982 | 3 | 0 |
| 1983 | 3 | 0 |
| 1984 | 0 | 0 |
| 1985 | 5 | 0 |
| 1986 | 6 | 0 |
| 1987 | 5 | 0 |
| 1988 | 2 | 0 |
| 1989 | 8 | 0 |
| 1990 | 11 | 0 |
| 1991 | 11 | 0 |
| 1992 | 16 | 0 |
| 1993 | 18 | 0 |
| 1994 | 18 | 0 |
| 1995 | 10 | 0 |
| 1996 | 22 | 0 |
| 1997 | 6 | 0 |
| 1998 | 7 | 0 |
| 1999 | 10 | 0 |
| 2000 | 16 | 0 |
| 2001 | 11 | 3 |
| 2002 | 23 | 19 |
| 2003 | 17 | 18 |
| 2004 | 16 | 30 |
| 2005 | 15 | 19 |
| 2006 | 10 | 17 |
| 2007 | 7 | 17 |
| 2008 | 11 | 21 |
| 2009 | 8 | 36 |
| 2010 | 14 | 25 |
| 2011 | 15 | 31 |
| 2012 | 22 | 21 |
| 2013 | 19 | 39 |
| 2014 | 20 | 42 |
| 2015 | 51 | 73 |
| 2016 | 30 | 57 |
| 2017 | 44 | 45 |
| 2018 | 35 | 37 |
| 2019 | 28 | 48 |
| 2020 | 38 | 47 |
| 2021 | 30 | 45 |
| 2022 | 43 | 60 |
| 2023 | 44 | 49 |
| 2024 | 38 | 47 |
| 2025 | 39 | 37 |
| 2026 | 27 | 31 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Oxygen detection system and reflow furnace using the same29 Sep 2026US 12,746,614 B2Illinois Tool Works Inc.
- Soldering device including pulsed light irradiator, soldering method using pulsed light irradiation, and method of manufacturing semiconductor package11 Aug 2026US 12,703,044 B2Samsung Electronics Co., Ltd.
- Fan assembly11 Aug 2026US 12,704,129 B2Illinois Tool Works Inc.
- Solder reflow apparatus and method of manufacturing an electronic device4 Aug 2026US 12,701,664 B2Samsung Electronics Co., Ltd.
- Reflow oven28 Jul 2026US 12,691,518 B2Illinois Tool Works Inc.
- Method for joining dissimilar materials of titanium metal and solder for vacuum vessel sealing1 Oct 2026US 2026/0295703 A1Shijiazhuang Tiedao University
- Semiconductor device substrate and method for producing semiconductor device substrate24 Sep 2026US 2026/0293676 A1NGK Insulators, Ltd.
- Reflow method and system17 Sep 2026US 2026/0273640 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Reflow oven3 Sep 2026US 2026/0257293 A1Illinois Tool Works Inc.
- Copper-ceramic substrate with an upper face which can be sintered20 Aug 2026US 2026/0248008 A1Heraeus Electronics GmbH & Co. KG
Most cited
By later US patents
- Cryogenic surgical instrument and method of manufacturing the same256US 5,573,532 ACryomedical Sciences, Inc. · 1996
- Conveyor oven control108US 5,253,564 AThe Middleby Corporation · 1993
- Drill bit and method of manufacture84US 4,350,215 ANL Industries, Inc. · 1982
- Method for soldering microstructured sheet metal68US 6,220,497 B1Xcellsis GmbH · 2001
- Conveyor oven control66US 5,197,375 AThe Middleby Corporation · 1993