Reflow oven
AssigneeIllinois Tool Works Inc.
InventorsBinhua YU, Weizhou LIU
Life of this patent
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AssigneeIllinois Tool Works Inc.
InventorsBinhua YU, Weizhou LIU
Estimating the term…
The present application discloses a reflow oven including: a furnace chamber; at least one negative pressure heating unit, each negative pressure heating unit including a negative pressure heating unit upper portion and a negative pressure heating unit lower portion; and a plurality of delivery channel sub-regions, where the negative pressure heating unit upper portion includes an upper fan (219), an upper suction channel (332), and an upper exhaust channel (334); the negative pressure heating unit lower portion includes a lower fan (220), a lower suction channel (333), and a lower exhaust channel (331); gas discharged from the lower fan exhaust port (335) flows through the lower exhaust channel and blows to the middle region of the delivery channel sub-region, then is sucked by the upper suction channel and delivered to the upper fan suction port (338), and the gas discharged from the upper fan exhaust port sequentially flows through the upper exhaust channel, the side regions of the delivery channel sub-region and the lower suction channel, and is then received by the lower fan suction port. In the reflow oven of the present application, when the circuit board is in the negative pressure heating unit, the gas above the circuit board forms a negative pressure to facilitate expelling of hollows in the soldering paste of the circuit board.
A reflow oven comprising:
Dependencies are inferred from the claim text.