Copper-ceramic substrate with an upper face which can be sintered
AssigneeHeraeus Electronics GmbH & Co. KG
InventorsTamira STEGMANN, Sven THOMAS
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AssigneeHeraeus Electronics GmbH & Co. KG
InventorsTamira STEGMANN, Sven THOMAS
Estimating the term…
The invention relates to a copper-ceramic substrate, to the use of a copper-ceramic substrate, and to a method for producing a bonded connection between a copper-ceramic substrate and an electronic component. The copper-ceramic substrate comprises: a) a ceramic body and b) a copper layer which is connected to the ceramic body in a planar manner, wherein the copper layer has an upper face. Prior to and after sputtering the upper face for 120 s, the copper-ceramic substrate has an energy spectrum which is obtained by means of x-ray photoelectron spectroscopy during an analysis of the upper face of the copper layer and which gives the copper-ceramic substrate a particular suitability for being bonded to an electronic component using a sintering material that comprises silver.
A copper-ceramic substrate comprising
Dependencies are inferred from the claim text.