Method for joining dissimilar materials of titanium metal and solder for vacuum vessel sealing

A method for joining dissimilar materials of a titanium metal and a solder for vacuum vessel sealing, comprising the following steps:

• 1) designing and preparing a metal transition section (1) according to composition, physical and chemical properties of a titanium metal (4) to be joined, wherein the metal transition section (1) is required to exhibit good chemical compatibility with the titanium metal (4);
• 2) designing and preparing a cladding material R according to compositions, physical and chemical properties of the metal transition section (1) and a solder D, wherein the cladding material R is required to exhibit good plasticity, as well as good chemical compatibility with the metal transition section (1) and good wettability with the solder D;
• 3) selecting a cladding heat source and determining a cladding process corresponding to the cladding heat source, setting process parameters for the cladding heat source, starting a first heat source device, and locally cladding a surface of the metal transition section (1) by using the cladding material R to prepare a cladding layer (2), thereby forming a bimetallic layer L composed of the cladding layer (2) and the metal transition section (1);
• 4) polishing a surface of the cladding layer (2), and stamping the bimetallic layer L from one surface of the cladding layer (2) by using a stamping device, to make the bimetallic layer L form a depression as well as a stamped hole (3) at a center, thus preparing a stamped bimetallic structural part W;
• 5) selecting a joining heat source and determining a joining process corresponding to the joining heat source, setting process parameters for the joining heat source, starting a second heat source device, and joining the titanium metal (4) and the metal transition section (1) in the stamped bimetallic structural part W to prepare a dissimilar material structural component S for vacuum sealing;
• 6) joining the dissimilar material structural component S for vacuum sealing with other parts of a vessel by welding to form a vessel V;
• and
• 7) placing the solder D at the stamped hole formed by stamping the bimetallic layer of the vessel V, then placing the vessel V in a vacuum furnace, setting process parameters, and starting the vacuum furnace to perform vacuum sealing between the solder D and the vessel V, thereby preparing a vacuum vessel.