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US 6,220,497 B1Granted
Method for soldering microstructured sheet metal
AssigneeXcellsis GmbH
InventorsUwe Benz, Lothar Haug, Wolfgang Kleinekathoefer, Peter Waitkat
Life of this patent
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Abstract
In method for soldering metal microstructured plates, stacks of plates and solder layers are prepared by placing the solder layers between each adjacent plate. The thickness of the solder layers range from 3 to 25 μm. The stack is then soldered by heating it in a vacuum or an inert atmosphere.
Claims27
A method for soldering metallic microstructured plates, comprising the steps of:
- preparing a stack by arranging solder layers having a thickness of 3 to 25 μm between pairs of adjacent plates;
- and
- applying heat to the stack in a vacuum or an inert atmosphere to solder the stack,
- wherein the plates have solder trapping channels.
1 more element
A method for soldering metallic microstructured plates, comprising:
- preparing a stack by arranging solder layers having a thickness of 3 to 25 μm between pairs of adjacent plates;
- and
- applying heat to the stack in a vacuum or an inert atmosphere to solder the stack,
- wherein said solder layers comprise a material selected from the group consisting of copper-palladium alloys, nickel-phosphorus alloys, gold-nickel alloys, and silver-titanium alloys.
1 more element
A method for soldering metallic microchanneled plates, comprising the steps of:
- coating a plurality of microchanneled plates, each plate having a coating of solder about 3 to 25 μm thick;
- stacking said plurality of microchanneled plates, thereby forming a stack;
- and
- applying heat to the stack in a vacuum or an inert atmosphere to solder the stack,
- wherein the microchanneled plates have solder trapping channels.
2 more elements
Dependencies are inferred from the claim text.