B23K 1/018
Unsoldering
Official title: Unsoldering; Removal of melted solder or other residues
B23K1/018 (Unsoldering) appears on 365 US grants and 198 published applications in this corpus.
Search patents in B23K- Granted patents
- 365
- Published applications
- 198
- Assignees
- 145
- Inventors
- 644
- Latest grant
- 12 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 7 | 0 |
| 1977 | 3 | 0 |
| 1978 | 3 | 0 |
| 1979 | 4 | 0 |
| 1980 | 10 | 0 |
| 1981 | 5 | 0 |
| 1982 | 2 | 0 |
| 1983 | 3 | 0 |
| 1984 | 8 | 0 |
| 1985 | 7 | 0 |
| 1986 | 9 | 0 |
| 1987 | 6 | 0 |
| 1988 | 9 | 0 |
| 1989 | 6 | 0 |
| 1990 | 6 | 0 |
| 1991 | 8 | 0 |
| 1992 | 7 | 0 |
| 1993 | 3 | 0 |
| 1994 | 5 | 0 |
| 1995 | 8 | 0 |
| 1996 | 10 | 0 |
| 1997 | 8 | 0 |
| 1998 | 11 | 0 |
| 1999 | 9 | 0 |
| 2000 | 14 | 0 |
| 2001 | 18 | 5 |
| 2002 | 12 | 4 |
| 2003 | 6 | 10 |
| 2004 | 10 | 14 |
| 2005 | 5 | 8 |
| 2006 | 2 | 13 |
| 2007 | 8 | 3 |
| 2008 | 8 | 4 |
| 2009 | 4 | 7 |
| 2010 | 7 | 6 |
| 2011 | 3 | 8 |
| 2012 | 9 | 7 |
| 2013 | 5 | 4 |
| 2014 | 3 | 8 |
| 2015 | 6 | 11 |
| 2016 | 12 | 10 |
| 2017 | 9 | 14 |
| 2018 | 7 | 11 |
| 2019 | 15 | 6 |
| 2020 | 8 | 7 |
| 2021 | 4 | 7 |
| 2022 | 7 | 12 |
| 2023 | 8 | 3 |
| 2024 | 7 | 8 |
| 2025 | 6 | 5 |
| 2026 | 5 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Removable stop-off material for brazing12 May 2026US 12,623,308 B2Prince & Izant, LLC
- Method for automated monitoring of a soldering process, soldering device with monitoring device14 Apr 2026US 12,603,467 B2ERSA GmbH
- Method and apparatus for debonding temporarily bonded wafers in wafer-level packaging applications27 Jan 2026US 12,538,830 B2PulseForge Inc.
- Angle-variable stirring and separating device for high-value components of waste PCB and control method thereof6 Jan 2026US 12,515,271 B2Changzhou University
- Method and apparatus for debonding temporarily bonded wafers in wafer-level packaging applications6 Jan 2026US 12,519,078 B2PulseForge Inc.
- Carrier for laser induced forward transfer and transfer apparatus comprising the same13 Aug 2026US 2026/0233341 A1Nexperia B. V.
- Desoldering equipment12 Mar 2026US 2026/0070140 A1Fu Tai Hua Industry (Shenzhen) Co., Ltd.
- Method and apparatus for debonding temporarily bonded wafers in wafer-level packaging applications22 Jan 2026US 2026/0026387 A1PulseForge Inc.
- Apparatus for repairing solder-ball13 Nov 2025US 2025/0345873 A1Samsung Electronics Co., Ltd.
- Stirring and separating device for high-value components of waste pcb and control method thereof28 Aug 2025US 2025/0269449 A1Changzhou University
Most cited
By later US patents
- Soldering/unsoldering arrangement86US 6,257,478 B1Cooper Tools GmbH · 2001
- Method and apparatus for removing known good die75US 6,360,940 B1International Business Machines Corporation · 2002
- Integrated circuit, electronic component chip removal and replacement system73US 5,598,965 A1997
- Method and apparatus for insulating moisture sensitive PBGA's72US 6,059,170 AInternational Business Machines Corporation · 2000
- Circuit package attachment apparatus and method53US 4,769,525 AHughes Aircraft Company · 1988