Desoldering equipment

Abstract

A desoldering equipment includes a carrier, a conveying assembly, a supporting assembly, a pressing assembly, a laser heating member, and a grabbing assembly. The carrier is configured to position a connecting board and a mainboard. The conveying assembly is configured to convey the carrier to a desoldering position along a first direction. The supporting assembly is arranged under the conveying assembly and configured to position the carrier at the desoldering position. The pressing assembly is arranged above the conveying assembly and configured to press down the mainboard in the carrier at the desoldering position. The laser heating member is configured to heat the connecting board in the carrier at the desoldering position. The grabbing assembly is configured to grab the connecting board on the mainboard pressed down by the pressing assembly and remove the connecting board. The desoldering equipment can remove the connecting board without damaging the mainboard.

Dependencies are inferred from the claim text.