Method for automated monitoring of a soldering process, soldering device with monitoring device

A soldering device for heating a substrate and/or an electronic component arranged on the substrate for desoldering and/or soldering the component in a manual soldering process, the soldering device comprising an energy dissipation parameter and a device position and/or a device acceleration,

• wherein the soldering device is configured to assume a soldering state, in which the soldering device heats a soldering point on the substrate and/or on the component by heat conduction and/or by heat radiation and/or by heat convection, and a handling state, in which the soldering device is moved toward and/or away from the soldering point,
• wherein the soldering device has a first energy dissipation in the soldering state and a second energy dissipation in the handling state, the first energy dissipation being greater than the second energy dissipation,
• wherein the soldering device has a first device position in the soldering state and a second device position in the handling state, and/or a first device acceleration in the soldering state and a second device acceleration in the handling state, the first device acceleration being less than the second device acceleration,
• wherein the soldering device comprises at least one state sensor generating a state signal indicative of the energy dissipation of the soldering device,
• wherein the soldering device further comprises at least one position sensor generating a position signal for detecting a time series of the device position of the soldering device and/or at least one acceleration sensor generating an acceleration signal for detecting a time series of the device acceleration of the soldering device,
• wherein the soldering device further comprises a monitoring device for monitoring the soldering state, the handling state, and a state of the soldering point and/or of the substrate and/or of the component,
• wherein the monitoring device is configured to determine the soldering state by measuring a predetermined first device position and/or a first device acceleration within a first acceleration range,
• wherein the monitoring device is configured to determine the handling state by measuring a second device position that is not predetermined and/or a second device acceleration within a second acceleration range, and
• wherein the monitoring device is configured to determine the state of the soldering point and/or of the substrate and/or of the component based on a time series of the energy dissipation and/or a time series of the device position and/or a time series of the device acceleration.