B23K 1/08
Soldering by means of dipping in molten solder
B23K1/08 (Soldering by means of dipping in molten solder) appears on 335 US grants and 224 published applications in this corpus.
Search patents in B23K- Granted patents
- 335
- Published applications
- 224
- Assignees
- 207
- Inventors
- 614
- Latest grant
- 7 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 4 | 0 |
| 1981 | 2 | 0 |
| 1982 | 4 | 0 |
| 1983 | 6 | 0 |
| 1984 | 6 | 0 |
| 1985 | 6 | 0 |
| 1986 | 12 | 0 |
| 1987 | 11 | 0 |
| 1988 | 7 | 0 |
| 1989 | 9 | 0 |
| 1990 | 6 | 0 |
| 1991 | 9 | 0 |
| 1992 | 7 | 0 |
| 1993 | 12 | 0 |
| 1994 | 12 | 0 |
| 1995 | 7 | 0 |
| 1996 | 5 | 0 |
| 1997 | 8 | 0 |
| 1998 | 8 | 0 |
| 1999 | 4 | 0 |
| 2000 | 9 | 0 |
| 2001 | 8 | 3 |
| 2002 | 11 | 11 |
| 2003 | 8 | 7 |
| 2004 | 8 | 9 |
| 2005 | 7 | 7 |
| 2006 | 3 | 7 |
| 2007 | 4 | 5 |
| 2008 | 3 | 8 |
| 2009 | 4 | 6 |
| 2010 | 3 | 14 |
| 2011 | 7 | 8 |
| 2012 | 9 | 8 |
| 2013 | 6 | 3 |
| 2014 | 1 | 7 |
| 2015 | 7 | 17 |
| 2016 | 11 | 16 |
| 2017 | 10 | 8 |
| 2018 | 13 | 11 |
| 2019 | 4 | 9 |
| 2020 | 6 | 14 |
| 2021 | 8 | 7 |
| 2022 | 11 | 12 |
| 2023 | 5 | 5 |
| 2024 | 6 | 5 |
| 2025 | 4 | 11 |
| 2026 | 6 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Radiant curtain heating assembly for wave soldering machine7 Jul 2026US 12,673,377 B2Illinois Tool Works Inc.
- System and method for combined wave solder flow design16 Jun 2026US 12,654,248 B2Illinois Tool Works Inc.
- Soldering system and method of use31 Mar 2026US 12,589,445 B2Illinois Tool Works Inc.
- Dual pump system and method to control wavesolder contact length3 Feb 2026US 12,543,271 B1Illinois Tool Works Inc.
- Mold for forming solder distal tip for guidewire27 Jan 2026US 12,533,496 B2Abbott Cardiovascular Systems Inc.
- Preheating mechanism of jet soldering apparatus, and jet soldering apparatus16 Jul 2026US 2026/0199996 A1Koki Tec Corp.
- Calibrating tool for a selective soldering unit, selective soldering installation and calibrating method16 Jul 2026US 2026/0206198 A1Hella GmbH & Co. KGaA
- Mold for forming solder distal tip for guidewire9 Jul 2026US 2026/0192093 A1Abbott Cardiovascular Systems Inc.
- Dual pump system and method to control wavesolder contact length18 Jun 2026US 2026/0173278 A1Illinois Tool Works Inc.
- Wave height control for wave soldering1 Jan 2026US 2026/0001154 A1Schweitzer Engineering Laboratories, Inc.
Most cited
By later US patents
- Applying solder to high density substrates139US 5,316,788 AInternational Business Machines Corporation · 1994
- Process for soldering electronic components to a printed circuit board75US 6,145,733 AHerbert Streckfuss GmbH · 2000
- Method of wave soldering thin laminate circuit boards68US 6,202,916 B1Delphi Technologies, Inc. · 2001
- Gas shrouded wave soldering with gas knife44US 5,240,169 AElectrovert Ltd. · 1993
- Multi stage heater42US 4,775,776 AElectrovert Ltd. · 1988