Gas shrouded wave soldering with gas knife
AssigneeElectrovert Ltd.
InventorJohn H. Gileta
Life of this patent
Estimating the term…
Abstract
A cover plate or shroud extends over a solder reservoir and has a slot for a solder wave to extend up above the cover plate. A reduced oxygen atmosphere is supplied from gas outlets under the cover plate on both sides of the solder wave. Furthermore a gas knife is located to direct a stream of gas on an element such as a circuit board as it passes through the solder wave. The cover plate or shroud provides reduced oxides on the solder surfaces and the gas knife removes excess solder on elements that have been solder coated. The apparatus has a solder reservoir for holding solder with a solder nozzle projecting therefrom and a pump for forming a solder wave from the nozzle. Two solder waves may be provided each with their own cover plate and gas supplied on each side of each wave below the cover plate.
Claims57
A process of wave soldering an element comprising the steps of:
- projecting at least one solder wave from a solder nozzle above a solder reservoir containing solder, through a slot in a cover means over the solder reservoir;
- providing shield gas underneath the cover means to pass through the slot on both sides of the solder wave and blanket the solder wave;
- passing the element in a predetermined path above the cover means so that at least a portion of the element passes through the solder wave while being blanketed by the shield gas, and
- projecting a linear jet of gas from a gas knife onto the element after the element passes through the solder wave to remove excess solder from the element.
A process for wave soldering an element comprising the steps of:
- projecting a solder wave from a solder nozzle above a solder reservoir containing low dross solder, through a slot in a cover means over the solder reservoir;
- providing a shield gas of nitrogen with oxygen in the range of 1 ppm to 50,000 ppm (5%), underneath the cover means to pass through the slot on both sides of the solder wave and blanket the solder wave, and
- passing the element in a predetermined path above the cover means so that at least a portion of the element passes through the solder wave while being blanketed by the shield gas.
An apparatus for wave soldering an element comprising:
- a solder reservoir adapted to contain molten solder, and having at least one solder wave nozzle projecting therefrom;
- pump means for forming a solder wave from the nozzle;
- cover means for covering at least a portion of the reservoir having at least one longitudinal slot for the solder wave to pass therethrough;
- supply means for supplying pressurized gas to the underside of the cover means, the gas permitted to pass upwards through the slot on both sides of the solder wave and provide a gas blanket over the solder wave;
- conveyor means for moving the element in a predetermined path over the cover means ensuring at least a portion of the element passes through the solder wave, and
- gas knife means located to project a linear jet of gas onto the element after the solder wave to blow off excess solder.
A cover for use with a solder reservoir having at least one solder wave nozzle and means for forming a solder wave from the nozzle, the cover comprising:
- a shroud means to surround the nozzle, the shroud means having at least one slot to fit over the solder wave and provide longitudinal gaps on both sides of the solder wave;
- gas diffuser means below the shroud means on both sides of the slot, adapted to permit gas to pass upwards through the longitudinal gaps on both sides of the solder wave, and
- gas knife positioned adjacent the solder wave nozzle outside the shroud means to project a linear jet of gas after the solder wave.
A process of wave soldering an element comprising the steps of:
- projecting at least one solder wave from a solder nozzle above a solder reservoir containing solder, through a slot in a cover means over at least a portion of the solder reservoir;
- providing gas delivery means positioned on each side of the solder wave underneath the cover means to pass shield gas through the slot on both sides of the solder wave and blanket the solder wave, and
- passing the element in a predetermined path above the cover means so that at least a portion of the element passes through the solder wave while being blanketed by the shield gas.
An apparatus for wave soldering an element comprising:
- a solder reservoir adapted to contain molten solder, and having at least one solder wave nozzle projecting therefrom;
- pump means for forming a solder wave from the nozzle;
- cover means for covering at least a portion of the reservoir having at least one longitudinal slot for the solder wave to pass therethrough;
- gas delivery means for supplying gas, positioned on each side of the solder wave underneath the cover means, the gas passing upwards through the slot on both sides of the solder wave to provide a gas blanket over the solder wave, and
- conveyor means for moving the element in a predetermined path over the cover means ensuring at least a portion of the element passes through the solder wave.
An apparatus for wave soldering an element comprising:
- a solder reservoir adapted to contain solder and having at least one solder wave nozzle projecting therefrom to produce a bidirectional non-turbulent solder wave;
- pump means for forming the bidirectional nonturbulent solder wave from the nozzle;
- cover means for covering at least a portion of the reservoir having at least one longitudinal slot for the solder wave to pass therethrough, the cover means at an elevation above the nozzle;
- gas delivery means for supplying pressurized gas to the underside of the cover means, the gas permitted to pass upwards through the slot on both sides of the solder wave and provide a gas blanket over the solder wave;
- and
- conveyor means for moving the element in a predetermined path over the cover means ensuring at least a portion of the element passes through the solder wave.
An apparatus for wave soldering an element comprising:
- a solder reservoir, adopted to contain solder and having at least one solder wave nozzle projecting therefrom;
- pump means for forming a solder wave from the nozzle;
- cover means for covering at least a portion of the reservoir having at least one longitudinal slot for the solder wave to pass therethrough;
- at least one damper plate on the cover means located on each side of the longitudinal slot, the damper plate being movable to vary the width of the longitudinal slot;
- gas delivery means for supplying pressurized gas to the underside of the cover means, the gas permitted to pass upwards through the slot on both sides of the solder wave and provide a gas blanket over the solder wave, and
- conveyor means for moving the element in a predetermined path over the cover means ensuring at least a portion of the element passes through the solder wave.
Dependencies are inferred from the claim text.