B23K 1/20
Preliminary treatment of work or areas to be soldered
Official title: Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
B23K1/20 (Preliminary treatment of work or areas to be soldered) appears on 1,241 US grants and 1,280 published applications in this corpus.
Search patents in B23K- Granted patents
- 1,241
- Published applications
- 1,280
- Assignees
- 758
- Inventors
- 3,259
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 6 | 0 |
| 1978 | 5 | 0 |
| 1979 | 7 | 0 |
| 1980 | 9 | 0 |
| 1981 | 6 | 0 |
| 1982 | 6 | 0 |
| 1983 | 3 | 0 |
| 1984 | 6 | 0 |
| 1985 | 9 | 0 |
| 1986 | 15 | 0 |
| 1987 | 8 | 0 |
| 1988 | 17 | 0 |
| 1989 | 8 | 0 |
| 1990 | 14 | 0 |
| 1991 | 10 | 0 |
| 1992 | 19 | 0 |
| 1993 | 16 | 0 |
| 1994 | 20 | 0 |
| 1995 | 22 | 0 |
| 1996 | 15 | 0 |
| 1997 | 15 | 0 |
| 1998 | 15 | 0 |
| 1999 | 15 | 0 |
| 2000 | 28 | 0 |
| 2001 | 26 | 12 |
| 2002 | 21 | 23 |
| 2003 | 26 | 23 |
| 2004 | 27 | 30 |
| 2005 | 18 | 23 |
| 2006 | 3 | 25 |
| 2007 | 10 | 23 |
| 2008 | 15 | 25 |
| 2009 | 15 | 30 |
| 2010 | 13 | 30 |
| 2011 | 17 | 51 |
| 2012 | 15 | 44 |
| 2013 | 41 | 76 |
| 2014 | 40 | 70 |
| 2015 | 55 | 142 |
| 2016 | 61 | 69 |
| 2017 | 77 | 80 |
| 2018 | 55 | 65 |
| 2019 | 62 | 69 |
| 2020 | 61 | 84 |
| 2021 | 60 | 60 |
| 2022 | 55 | 55 |
| 2023 | 56 | 62 |
| 2024 | 42 | 58 |
| 2025 | 47 | 33 |
| 2026 | 23 | 18 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Workpiece plating treatment method and workpiece manufacturing method25 Aug 2026US 12,715,073 B2Tyco Electronics (Shanghai) Co., Ltd.
- Circuit board and manufacturing method18 Aug 2026US 12,713,535 B2NHK Spring Co., Ltd.
- Bumps comprising tin, cooper and bismuth for liquid metal socket interconnects4 Aug 2026US 12,702,042 B2Intel Corporation
- System and method for determining whether to clean a reflow oven14 Jul 2026US 12,678,878 B2Illinois Tool Works Inc.
- Surface treatment method14 Jul 2026US 12,678,879 B2L Air Liquide, Societe Anonyme Pour L'Etude et L'Exploitation des Procedes Georges Claude
- Method for joining dissimilar materials of titanium metal and solder for vacuum vessel sealing1 Oct 2026US 2026/0295703 A1Shijiazhuang Tiedao University
- Method of cleaning a bottom plate3 Sep 2026US 2026/0257289 A1Ableprint Technology Co., Ltd.
- Method of cleaning a bottom plate3 Sep 2026US 2026/0257291 A1Ableprint Technology Co., Ltd.
- Method of Brazing Golf Club Components13 Aug 2026US 2026/0233320 A1Callaway Golf Company
- Soldering method30 Jul 2026US 2026/0216807 A1Infineon Technologies AG
Most cited
By later US patents
- Additive manufacturing of active devices using dielectric, conductive and magnetic materials323US 10,254,499 B1Southern Methodist University · 2019
- Method and apparatus for dispensing small amounts of liquid material245US 5,747,102 ANordson Corporation · 1998
- Method of securing metallic members together188US 4,727,633 ATektronix, Inc. · 1988
- Apparatus and method for injection molding solder and applications thereof186US 5,244,143 AInternational Business Machines Corporation · 1993
- Method and apparatus for dispensing small amounts of liquid material185US 6,253,957 B1Nordson Corporation · 2001