Surface treatment method
AssigneeL'Air Liquide, Societe Anonyme pour l'Etude et l'Exploitation des Procedes Georges Claude
InventorsWentan Wu, Yunhong Yu, Zhijun Huang
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Abstract
A surface treatment method. Atmospheric plasma is provided, and an object to be treated is placed in an atmospheric plasma atmosphere, wherein a residual oxygen level in the atmospheric plasma atmosphere is lower than a pre-set value. A soldering process is integrated into an atmospheric plasma treatment system without any flux protection, and it is ensured that the oxygen level in the atmosphere is reduced to an extremely low level, which can meet the high requirements for surface soldering performance.
Claims10
A surface treatment method using an atmospheric plasma treatment system comprising carrying platforms for placing and fixing an object to be treated, transition chambers, an atmospheric plasma treatment chamber, and a reflow solder chamber, the method comprising:
- providing atmospheric plasma, and
- placing an object to be treated in an atmospheric plasma atmosphere,
- wherein the transition chambers and the atmospheric plasma chamber use an inert gas to replace the air and to maintain a required residual oxygen level
- wherein the residual oxygen level in the atmospheric plasma atmosphere is lower than a pre-set value of 50 ppm, and
- wherein the atmospheric plasma sweeps the object to be treated at a speed of 10 mm/s to 300 mm/s.
Dependencies are inferred from the claim text.