B23K 1/203
Fluxing, i.e. applying flux onto surfaces
Official title: {Fluxing, i.e. applying flux onto surfaces}
B23K1/203 (Fluxing, i.e. applying flux onto surfaces) appears on 406 US grants and 440 published applications in this corpus.
Search patents in B23K- Granted patents
- 406
- Published applications
- 440
- Assignees
- 268
- Inventors
- 1,134
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 0 | 0 |
| 1990 | 2 | 0 |
| 1991 | 1 | 0 |
| 1992 | 4 | 0 |
| 1993 | 3 | 0 |
| 1994 | 10 | 0 |
| 1995 | 7 | 0 |
| 1996 | 6 | 0 |
| 1997 | 9 | 0 |
| 1998 | 6 | 0 |
| 1999 | 8 | 0 |
| 2000 | 14 | 0 |
| 2001 | 12 | 5 |
| 2002 | 9 | 11 |
| 2003 | 11 | 8 |
| 2004 | 10 | 12 |
| 2005 | 4 | 9 |
| 2006 | 0 | 8 |
| 2007 | 4 | 11 |
| 2008 | 6 | 4 |
| 2009 | 6 | 10 |
| 2010 | 6 | 13 |
| 2011 | 5 | 14 |
| 2012 | 8 | 21 |
| 2013 | 16 | 28 |
| 2014 | 12 | 32 |
| 2015 | 21 | 53 |
| 2016 | 21 | 25 |
| 2017 | 36 | 24 |
| 2018 | 22 | 33 |
| 2019 | 22 | 24 |
| 2020 | 21 | 21 |
| 2021 | 19 | 19 |
| 2022 | 16 | 9 |
| 2023 | 15 | 15 |
| 2024 | 7 | 13 |
| 2025 | 12 | 11 |
| 2026 | 7 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Substrate processing apparatus14 Jul 2026US 12,678,882 B2Samsung Electronics Co., Ltd.
- Braze product including additive particles and methods of brazing9 Jun 2026US 12,649,203 B2Lucas-Milhaupt, Inc.
- Method of brazing golf club components14 Apr 2026US 12,599,982 B1Topgolf Callaway Brands Corp.
- Vacuum adiabatic body and method for manufacturing the same3 Mar 2026US 12,566,024 B2LG Electronics Inc.
- Selective stencil mask and a stencil printing method17 Feb 2026US 12,552,192 B2
- Method of Brazing Golf Club Components13 Aug 2026US 2026/0233320 A1Callaway Golf Company
- Soldering method30 Jul 2026US 2026/0216807 A1Infineon Technologies AG
- Selective stencil mask and a stencil printing method30 Jul 2026US 2026/0217046 A1STATS ChipPAC Pte. Ltd.
- High-strength solder-plated al-mg-si aluminum material2 Jul 2026US 2026/0185202 A2Speira GmbH
- Dual pump system and method to control wavesolder contact length18 Jun 2026US 2026/0173278 A1Illinois Tool Works Inc.
Most cited
By later US patents
- Method and apparatus for dispensing small amounts of liquid material245US 5,747,102 ANordson Corporation · 1998
- Method and apparatus for dispensing small amounts of liquid material185US 6,253,957 B1Nordson Corporation · 2001
- Pad grid array for receiving a solder bumped chip carrier132US 4,940,181 AMotorola, Inc. · 1990
- Bonding a non-metal body to a metal surface using inductive heating70US 7,452,800 B2The Regents of the University of California · 2008
- Method and apparatus for use in forming pre-positioned solder bumps on a pad arrangement44US 5,323,947 AMotorola, Inc. · 1994