Selective stencil mask and a stencil printing method
OwnerHyunSeok Park, KyoWang Koo +2inventors
InventorsHyunSeok Park, KyoWang Koo, SeongKuk Kim, SeokBeom Heo
Life of this patent
Estimating the term…
Abstract
A selective stencil mask and a stencil printing method are provided. The stencil mask is for printing a fluid material onto a substrate, and comprises: a stencil member comprising: at least one printing region each having an array of apertures that allow the fluid material to flow therethrough and deposit onto the substrate; and a blocking region configured to prevent the fluid material from flowing therethrough; and a supporting member attached to the stencil member and configured to, when the stencil mask is placed on the substrate, contact the substrate and create a gap between the stencil member and the substrate.
Claims10
A method for forming a semiconductor package, comprising:
- providing a first substrate and a second substrate;
- forming in a first region of the first substrate a first plurality of solder bumps using a first stencil mask;
- forming in a second region of the first substrate a second plurality of solder bumps using a second stencil mask;
- forming solder bumps on the second substrate;
- aligning the first plurality of solder bumps and the second plurality of solder bumps on the first substrate with the solder bumps on the second substrate to connect the first substrate with the second substrate;
- and
- reflowing the first plurality of solder bumps and the second plurality of solder bumps on the first substrate and the solder bumps on the second substrate.
A method for forming a semiconductor package, comprising:
- providing a first substrate and a second substrate;
- forming in a first region of the first substrate a first plurality of solder bumps and in a second region of the first substrate a second plurality of solder bumps using a first stencil mask;
- depositing onto the second plurality of solder bumps flux using a second stencil mask;
- forming solder bumps on the second substrate;
- aligning the first plurality of solder bumps and the second plurality of solder bumps on the first substrate with the solder bumps on the second substrate to connect the first substrate with the second substrate;
- and
- reflowing the first plurality of solder bumps and the second plurality of solder bumps on the first substrate and the solder bumps on the second substrate.
Dependencies are inferred from the claim text.