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AssigneeMotorola, Inc.
InventorsFrank Juskey, Kenneth M. Wasko, Douglas W. Hendricks
Estimating the term…
A method and apparatus for use in forming pre-positioned solder bumps (104) on a pad arrangement (100) of a substrate (101) include placing a predetermined pattern (306) of solder preforms (304) in contact with a meltable adhesive fluxing agent (302) on a carrier tape (402), and then heating the fluxing agent (302) to melt it. Next, the fluxing agent (302) is cooled to resolidify it, thereby securing the solder preforms (304) to the carrier tape (402). The carrier tape (402) is then aligned over the pad arrangement (100) and the solder preforms (304) are transferred to the pad arrangement (100) by heating the solder preforms (304) to form the solder bumps (104) in the predetermined pattern (306).
A method of attaching a predetermined pattern of solder preforms onto a carrier tape for use in forming pre-positioned solder bumps on a pad arrangement of a substrate, the method comprising the steps of:
A method of forming pre-positioned solder bumps on a pad arrangement of a substrate, the method comprising the steps of:
A processed tape for use in forming pre-positioned solder bumps on a pad arrangement of a substrate, the processed tape comprising:
Dependencies are inferred from the claim text.