Selective stencil mask and a stencil printing method
AssigneeSTATS ChipPAC Pte. Ltd.
InventorsHyunSeok PARK, KyoWang KOO, SeongKuk KIM, SeokBeom HEO
Life of this patent
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Abstract
A selective stencil mask and a stencil printing method are provided. The stencil mask is for printing a fluid material onto a substrate, and comprises: a stencil member comprising: at least one printing region each having an array of apertures that allow the fluid material to flow therethrough and deposit onto the substrate; and a blocking region configured to prevent the fluid material from flowing therethrough; and a supporting member attached to the stencil member and configured to, when the stencil mask is placed on the substrate, contact the substrate and create a gap between the stencil member and the substrate.
Claims10
A stencil mask for printing a fluid material onto a substrate, wherein the stencil mask comprises:
- a stencil member comprising:
- at least one printing region each having an array of apertures that allow the fluid material to flow therethrough and deposit onto the substrate;
- and
- a blocking region configured to prevent the fluid material from flowing therethrough;
- and
- a supporting member attached to the stencil member and configured to, when the stencil mask is placed on the substrate, contact the substrate and create a gap between the stencil member and the substrate.
Dependencies are inferred from the claim text.