Soldering method

Abstract

A soldering method is provided. The soldering method includes arranging a solder preform between a first metal surface and a second metal surface, arranging a reducing component between the first metal surface and the solder preform and between the second metal surface and the solder preform, and heating the solder preform to its melting temperature, which is higher than a boiling point of the reducing component, wherein the reducing component consists of: a reducing agent, or consists of: a reducing agent and a solvent, wherein the reducing agent consists of at least one of the following: a glycerol or its derivatives, a polyhydric alcohol (HOCH2(CHOH)nCH2OH with n=1 to 100), a polyethylene glycol (H—(O—CH2-CH2)n-OH (with n=1 to 1000), and a glycol (aliphatic diol), and wherein the solvent consists of at least one of the following: water, a glycol, an ether, glycolether, ethanol, propanol, and hexanol.

Dependencies are inferred from the claim text.