Workpiece plating treatment method and workpiece manufacturing method

A workpiece plating treatment method, comprising the steps of:

• providing a pulse laser having a plurality of different energy levels, at least one of a scanning speed, a pulse frequency, a pulse power, and a pulse width of the pulse laser at the different energy levels is different;
• adjusting the pulse laser to an activation energy level and scanning a plating layer on a workpiece to remove a plurality of oxides, dirt, and dust from a surface of the plating layer and activate the surface of the plating layer;
• adjusting the pulse laser to a temperature rise energy level and scanning the plating layer on the workpiece to heat the plating layer to a temperature rise zone;
• adjusting the pulse laser to a constant temperature energy level and scanning the plating layer on the workpiece to heat the plating layer to a constant temperature zone higher than the temperature rise zone;
• adjusting the pulse laser to a melting energy level and scanning the plating layer on the workpiece to heat the plating layer to a melting zone higher than the constant temperature zone;
• adjusting the pulse laser to a cooling energy level and scanning the plating layer on the workpiece to cool the plating layer to a cooling zone lower than the melting zone;
• and
• adjusting the pulse laser to a polishing energy level and scanning the plating layer on the workpiece to remove the oxides from the surface of the plating layer and to flatten the surface of the plating layer.