B23K 1/012
Soldering with the use of hot gas
B23K1/012 (Soldering with the use of hot gas) appears on 391 US grants and 235 published applications in this corpus.
Search patents in B23K- Granted patents
- 391
- Published applications
- 235
- Assignees
- 213
- Inventors
- 845
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 3 | 0 |
| 1978 | 4 | 0 |
| 1979 | 1 | 0 |
| 1980 | 5 | 0 |
| 1981 | 3 | 0 |
| 1982 | 4 | 0 |
| 1983 | 9 | 0 |
| 1984 | 4 | 0 |
| 1985 | 5 | 0 |
| 1986 | 12 | 0 |
| 1987 | 20 | 0 |
| 1988 | 16 | 0 |
| 1989 | 12 | 0 |
| 1990 | 7 | 0 |
| 1991 | 6 | 0 |
| 1992 | 6 | 0 |
| 1993 | 8 | 0 |
| 1994 | 4 | 0 |
| 1995 | 8 | 0 |
| 1996 | 14 | 0 |
| 1997 | 4 | 0 |
| 1998 | 10 | 0 |
| 1999 | 8 | 0 |
| 2000 | 16 | 0 |
| 2001 | 16 | 7 |
| 2002 | 15 | 10 |
| 2003 | 12 | 10 |
| 2004 | 8 | 8 |
| 2005 | 3 | 9 |
| 2006 | 5 | 12 |
| 2007 | 2 | 5 |
| 2008 | 5 | 3 |
| 2009 | 2 | 10 |
| 2010 | 7 | 5 |
| 2011 | 6 | 7 |
| 2012 | 4 | 4 |
| 2013 | 4 | 6 |
| 2014 | 4 | 14 |
| 2015 | 7 | 21 |
| 2016 | 12 | 14 |
| 2017 | 10 | 12 |
| 2018 | 12 | 11 |
| 2019 | 10 | 8 |
| 2020 | 8 | 6 |
| 2021 | 5 | 6 |
| 2022 | 8 | 8 |
| 2023 | 5 | 17 |
| 2024 | 9 | 10 |
| 2025 | 10 | 8 |
| 2026 | 9 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Cable connection structure and method for manufacturing cable connection structure25 Aug 2026US 12,718,971 B2Proterial, Ltd.
- Solder reflow apparatus and method of manufacturing an electronic device4 Aug 2026US 12,697,671 B2Samsung Electronics Co., Ltd.
- Bumps comprising tin, cooper and bismuth for liquid metal socket interconnects4 Aug 2026US 12,702,042 B2Intel Corporation
- Solder reflow apparatus and method of manufacturing electronic device2 Jun 2026US 12,648,453 B2Samsung Electronics Co., Ltd.
- Device and method for controlled heat transfer, in particular to workpieces of large dimensions and masses by means of a condensing liquid26 May 2026US 12,636,723 B2
- Solder reflow apparatus and method of manufacturing electronic device17 Sep 2026US 2026/0282943 A1Samsung Electronics Co., Ltd.
- Process Chamber with UV Irradiance30 Jul 2026US 2026/0216806 A1Yield Engineering Systems, Inc.
- Dispensing heater and methods of use9 Apr 2026US 2026/0101446 A1Nano Dimension Technologies, Ltd.
- Reflow soldering oven22 Jan 2026US 2026/0025932 A1Illinois Tool Works Inc.
- Semiconductor processing tool and methods of operation27 Nov 2025US 2025/0364480 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Methods and apparatus for bonding an article to a metallized substrate81US 4,295,596 AWestern Electric Company, Inc. · 1981
- Method and apparatus for assembling ball grid array components on printed circuit boards by reflowing before placement81US 5,516,030 ACompaq Computer Corporation · 1996
- Vapour phase treatment process and apparatus71US 4,838,476 AFluocon Technologies Inc. · 1989
- Method and process of contract to a heat softened solder ball array67US 6,329,637 B1Micron Technology, Inc. · 2001
- Focused convection reflow soldering method and apparatus63US 4,771,929 AHollis Automation, Inc. · 1988