B23K 1/015
Vapour-condensation soldering
B23K1/015 (Vapour-condensation soldering) appears on 117 US grants and 38 published applications in this corpus.
Search patents in B23K- Granted patents
- 117
- Published applications
- 38
- Assignees
- 58
- Inventors
- 188
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 3 | 0 |
| 1978 | 3 | 0 |
| 1979 | 0 | 0 |
| 1980 | 3 | 0 |
| 1981 | 2 | 0 |
| 1982 | 4 | 0 |
| 1983 | 7 | 0 |
| 1984 | 3 | 0 |
| 1985 | 3 | 0 |
| 1986 | 5 | 0 |
| 1987 | 15 | 0 |
| 1988 | 9 | 0 |
| 1989 | 7 | 0 |
| 1990 | 3 | 0 |
| 1991 | 2 | 0 |
| 1992 | 3 | 0 |
| 1993 | 3 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 3 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 4 | 2 |
| 2002 | 2 | 1 |
| 2003 | 2 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 2 |
| 2006 | 0 | 0 |
| 2007 | 0 | 2 |
| 2008 | 1 | 0 |
| 2009 | 0 | 1 |
| 2010 | 1 | 2 |
| 2011 | 0 | 0 |
| 2012 | 0 | 1 |
| 2013 | 0 | 1 |
| 2014 | 0 | 1 |
| 2015 | 0 | 0 |
| 2016 | 1 | 2 |
| 2017 | 3 | 0 |
| 2018 | 0 | 1 |
| 2019 | 0 | 1 |
| 2020 | 2 | 3 |
| 2021 | 0 | 3 |
| 2022 | 5 | 2 |
| 2023 | 2 | 4 |
| 2024 | 2 | 5 |
| 2025 | 5 | 3 |
| 2026 | 4 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Solder reflow apparatus and method of manufacturing an electronic device4 Aug 2026US 12,697,671 B2Samsung Electronics Co., Ltd.
- Device and method for controlled heat transfer, in particular to workpieces of large dimensions and masses by means of a condensing liquid26 May 2026US 12,636,723 B2
- Process chamber with UV irradiance24 Mar 2026US 12,583,043 B2Yield Engineering Systems, Inc.
- Solder reflow apparatus and method of manufacturing an electronic device6 Jan 2026US 12,519,077 B2Samsung Electronics Co., Ltd.
- Reflow soldering machine for continuously soldering of soldering goods26 Aug 2025US 12,402,256 B2
- Process Chamber with UV Irradiance30 Jul 2026US 2026/0216806 A1Yield Engineering Systems, Inc.
- Method of using processing oven4 Sep 2025US 2025/0276394 A1Yield Engineering Systems, Inc.
- Solder reflow apparatus and method of manufacturing an electronic device22 May 2025US 2025/0167166 A1Samsung Electronics Co., Ltd.
- Solder reflow apparatus and method of manufacturing an electronic device6 Feb 2025US 2025/0046750 A1Samsung Electronics Co., Ltd.
- Solder reflow apparatus and method of manufacturing electronic device5 Sep 2024US 2024/0293884 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Vapour phase treatment process and apparatus71US 4,838,476 AFluocon Technologies Inc. · 1989
- Continuous vapor processing system47US 4,389,797 AHTC Corporation · 1983
- Method and apparatus for soldering, fusing or brazing46US 4,077,467 A1978
- Method and apparatus for condensation heating46US 4,321,031 A1982
- Method and apparatus for improved temperature control in rapid thermal processing (RTP) systems45US 5,841,110 ASteag AST · 1998