Solder reflow apparatus and method of manufacturing electronic device

A method of manufacturing an electronic device, the method comprising:

• providing a substrate having a plurality of bonding pads formed on a first surface of the substrate;
• attaching solder balls on the bonding pads respectively;
• disposing at least one radiant heating cover on the first surface of the substrate to cover the solder balls;
• loading the substrate on which the at least one radiant heating cover is disposed into a vapor generating chamber that accommodates a first heat transfer fluid therein;
• heating the first heat transfer fluid to form a second heat transfer fluid in a vapor phase within the chamber;
• supplying the second heat transfer fluid in the vapor phase to a surface of the radiant heating cover and blocking the second heat transfer fluid in the vapor phase from moving to the solder balls under the radiant heating cover;
• and
• soldering the solder balls by transferring heat generated when the second heat transfer fluid is brought to contact the surface of the radiant heating cover and condenses, toward the solder balls as radiant heat emitted from the radiant heating cover.

A method of manufacturing an electronic device, the method comprising:

• providing a substrate having a plurality of bonding pads formed on a first surface of the substrate;
• coating a solder paste on the plurality of bonding pads;
• attaching solder members on the bonding pads respectively;
• disposing at least one radiant heating cover on the first surface of the substrate to cover the solder members;
• loading the substrate on which the at least one radiant heating cover is disposed into a vapor generating chamber that accommodates a first heat transfer fluid therein;
• heating the first heat transfer fluid to form a second heat transfer fluid in a vapor phase within the chamber;
• supplying the second heat transfer fluid in the vapor phase to a surface of the radiant heating cover and blocking the second heat transfer fluid in the vapor phase from moving to the solder members under the radiant heating cover;
• and
• soldering the solder members by transferring heat generated when the second heat transfer fluid is brought to contact the surface of the radiant heating cover and condenses, toward the solder members as radiant heat emitted from the radiant heating cover.