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US 12,636,723 B2Granted
Device and method for controlled heat transfer, in particular to workpieces of large dimensions and masses by means of a condensing liquid
AssigneeEva Maria Leicht
InventorHelmut Walter Leicht
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Abstract
The present invention generally relates to a device, a system comprising a plurality of devices and a method for controlled heat transfer, in particular by means of a condensing liquid, to workpieces, and in particular for soldering items to be soldered in a vapor phase zone. The vapor formed when the items to be soldered are immersed in the vapor phase zone is discharged and recovered. The immersion of the items to be soldered in the vapor phase zone and the removal of the items to be soldered from the vapor phase zone is realised in a simple manner.
Claims17
A device for heat treating a workpiece in a vapor phase zone, comprising:
- (a) a first chamber open at the top and provided with a heater, which comprises the vapor phase zone,
- (b) a second chamber comprising a bottom and side walls, which surrounds the first chamber and is provided with a mounting for the workpiece, and
- (c) a lifting device for lifting and lowering the first chamber in the second chamber and immersing the workpiece in the vapor phase zone when lifting the first chamber,
- further comprising:
- means for discharging the vapor escaping the first chamber through the upper opening, and
- means for returning the discharged vapor or vapor condensate to the first chamber,
- wherein a fluid flow space is provided between one of the side walls of the second chamber and the first chamber when in the lifted position to facilitate the discharging of the vapor escaping the first chamber and the returning the discharged vapor to the first chamber.
4 more elements
Dependencies are inferred from the claim text.