B23K 1/19
Taking account of the properties of the materials to be soldered
Official title: taking account of the properties of the materials to be soldered
B23K1/19 (Taking account of the properties of the materials to be soldered) appears on 832 US grants and 949 published applications in this corpus.
Search patents in B23K- Granted patents
- 832
- Published applications
- 949
- Assignees
- 577
- Inventors
- 2,415
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 14 | 0 |
| 1977 | 7 | 0 |
| 1978 | 7 | 0 |
| 1979 | 5 | 0 |
| 1980 | 6 | 0 |
| 1981 | 5 | 0 |
| 1982 | 4 | 0 |
| 1983 | 5 | 0 |
| 1984 | 3 | 0 |
| 1985 | 4 | 0 |
| 1986 | 2 | 0 |
| 1987 | 8 | 0 |
| 1988 | 9 | 0 |
| 1989 | 6 | 0 |
| 1990 | 9 | 0 |
| 1991 | 12 | 0 |
| 1992 | 7 | 0 |
| 1993 | 7 | 0 |
| 1994 | 4 | 0 |
| 1995 | 6 | 0 |
| 1996 | 3 | 0 |
| 1997 | 5 | 0 |
| 1998 | 2 | 0 |
| 1999 | 4 | 0 |
| 2000 | 11 | 0 |
| 2001 | 11 | 6 |
| 2002 | 9 | 8 |
| 2003 | 13 | 13 |
| 2004 | 5 | 8 |
| 2005 | 10 | 15 |
| 2006 | 3 | 10 |
| 2007 | 2 | 7 |
| 2008 | 6 | 13 |
| 2009 | 3 | 21 |
| 2010 | 8 | 18 |
| 2011 | 10 | 19 |
| 2012 | 12 | 22 |
| 2013 | 15 | 54 |
| 2014 | 22 | 38 |
| 2015 | 36 | 79 |
| 2016 | 34 | 98 |
| 2017 | 52 | 85 |
| 2018 | 67 | 63 |
| 2019 | 66 | 66 |
| 2020 | 73 | 75 |
| 2021 | 47 | 51 |
| 2022 | 39 | 39 |
| 2023 | 40 | 52 |
| 2024 | 41 | 41 |
| 2025 | 26 | 26 |
| 2026 | 27 | 22 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- High-strength solder-plated Al—Mg—Si aluminum material6 Oct 2026US 12,753,475 B2Speira GmbH
- Multilayer rod, sealing unit, package forming apparatus, packaging machine, method for manufacturing a multilater rod and method for manufacturing an induction sealing device1 Sep 2026US 12,722,830 B2Tetra Laval Holdings & Finance S. A.
- Glass plate module21 Jul 2026US 12,689,139 B2Nippon Sheet Glass Co., Ltd.
- Bonded substrate14 Jul 2026US 12,679,778 B2NGK Insulators, Ltd.
- Apparatus and methods for tool mark free stitch bonding7 Jul 2026US 12,677,378 B2Skyworks Solutions, Inc.
- Bolt with wear protection24 Sep 2026US 2026/0287003 A1Caterpillar Inc.
- Copper-ceramic substrate with an upper face which can be sintered20 Aug 2026US 2026/0248008 A1Heraeus Electronics GmbH & Co. KG
- Copper-ceramic substrate with an upper face which can be sintered20 Aug 2026US 2026/0248009 A1Heraeus Electronics GmbH & Co. KG
- Method of Brazing Golf Club Components13 Aug 2026US 2026/0233320 A1Callaway Golf Company
- Heat exchanger, method for manufacturing the same, and refrigeration apparatus6 Aug 2026US 2026/0227137 A1Daikin Industries, Ltd.
Most cited
By later US patents
- Additive manufacturing of active devices using dielectric, conductive and magnetic materials323US 10,254,499 B1Southern Methodist University · 2019
- Drill bit with cemented carbide inserts136US 4,951,762 ASandvik AB · 1990
- Direct bonding of metals to ceramics and metals132US 3,994,430 AGeneral Electric Company · 1976
- Diamond abrasive tool128US 4,018,576 AAbrasive Technology, Inc. · 1977
- Hermetically bonding ceramic and titanium with a Ti-Pd braze interface90US 7,771,838 B1Boston Scientific Neuromodulation Corporation · 2010