B23K 1/0008
Soldering: specially adapted for particular articles or work
Official title: {specially adapted for particular articles or work}
B23K1/0008 (Soldering: specially adapted for particular articles or work) appears on 3,607 US grants and 4,359 published applications in this corpus.
Search patents in B23K- Granted patents
- 3,607
- Published applications
- 4,359
- Assignees
- 1,638
- Inventors
- 8,772
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 19 | 0 |
| 1977 | 10 | 0 |
| 1978 | 8 | 0 |
| 1979 | 7 | 0 |
| 1980 | 6 | 0 |
| 1981 | 4 | 0 |
| 1982 | 4 | 0 |
| 1983 | 4 | 0 |
| 1984 | 6 | 0 |
| 1985 | 12 | 0 |
| 1986 | 9 | 0 |
| 1987 | 12 | 0 |
| 1988 | 10 | 0 |
| 1989 | 14 | 0 |
| 1990 | 10 | 0 |
| 1991 | 14 | 0 |
| 1992 | 26 | 0 |
| 1993 | 36 | 0 |
| 1994 | 36 | 0 |
| 1995 | 29 | 0 |
| 1996 | 30 | 0 |
| 1997 | 28 | 0 |
| 1998 | 26 | 0 |
| 1999 | 33 | 0 |
| 2000 | 41 | 0 |
| 2001 | 46 | 22 |
| 2002 | 51 | 52 |
| 2003 | 54 | 71 |
| 2004 | 65 | 110 |
| 2005 | 62 | 104 |
| 2006 | 50 | 99 |
| 2007 | 43 | 99 |
| 2008 | 46 | 107 |
| 2009 | 38 | 158 |
| 2010 | 80 | 129 |
| 2011 | 82 | 178 |
| 2012 | 105 | 151 |
| 2013 | 107 | 187 |
| 2014 | 116 | 199 |
| 2015 | 174 | 378 |
| 2016 | 177 | 297 |
| 2017 | 272 | 323 |
| 2018 | 223 | 237 |
| 2019 | 225 | 223 |
| 2020 | 223 | 221 |
| 2021 | 176 | 179 |
| 2022 | 163 | 207 |
| 2023 | 173 | 204 |
| 2024 | 167 | 178 |
| 2025 | 144 | 164 |
| 2026 | 111 | 82 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Manufacturing method for heat exchanger6 Oct 2026US 12,752,357 B2Daikin Industries, Ltd.
- Pin brazed mounting arrangement6 Oct 2026US 12,752,359 B1Tractian Technologies Inc
- Solder bump forming member, method for manufacturing solder bump forming member, and method for manufacturing electrode substrate provided with solder bump6 Oct 2026US 12,752,360 B2Resonac Corporation
- Devices, systems, and methods for a cutting element6 Oct 2026US 12,753,658 B2Schlumberger Technology Corporation
- Electrically patterned polycrystalline diamond compact for sensing applications6 Oct 2026US 12,754,083 B2Schlumberger Technology Corporation
- Vacuum adiabatic body and method for manufacturing the same8 Oct 2026US 2026/0309404 A1LG Electronics Inc.
- Improved cable connecting piece8 Oct 2026US 2026/0312306 A1Safetrack Infrasystems SISAB AB
- Non-magnetization modification source-containing paste, non-magnetization device, rotor core, and method for manufacturing the same1 Oct 2026US 2026/0295736 A1Honda Motor Co., Ltd.
- Braze repair using metal coupon with porous region24 Sep 2026US 2026/0284808 A1GE Vernova Infrastructure Technology LLC
- Bolt with wear protection24 Sep 2026US 2026/0287003 A1Caterpillar Inc.
Most cited
By later US patents
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Additive manufacturing of active devices using dielectric, conductive and magnetic materials323US 10,254,499 B1Southern Methodist University · 2019
- Method of mounting resilient contact structures to semiconductor devices254US 5,829,128 AFormFactor, Inc. · 1998
- Wafer-to-wafer transfer of microstructures using break-away tethers240US 6,142,358 AThe Regents of the University of California · 2000
- Golf club head207US 6,319,149 B12001