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US 6,142,358 AGranted
Wafer-to-wafer transfer of microstructures using break-away tethers
AssigneeThe Regents of the University of California
InventorsMichael B. Cohn, Roger T. Howe
Life of this patent
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Abstract
Break-away tethers to secure electronic, mechanical, optical, or other microstructures, during release from one substrate and transfer to another. Microstructures are fabricated with integrated tethers attaching them to a first substrate. The structures are undercut by etching and contacted and bonded to a second substrate. First and second substrates are separated, breaking the tethers.
Claims5
An apparatus for transferring a microfabricated structure, comprising:
- a handle substrate;
- a set of anchors positioned on said handle substrate;
- a platform supporting a microfabricated structure;
- a set of tethers connected between said set of anchors and said platform, said set of tethers assuming a load bearing state to support said platform in the absence of a transfer load, said set of tethers assuming a detached tether state from said anchors in the presence of said transfer load;
- and
- a transition mechanism attached to said platform, said transition mechanism adapted to engage a target structure in the presence of said transfer load, which causes said detached tether state, resulting in said transition mechanism and said platform being attached to said target structure.
3 more elements
Dependencies are inferred from the claim text.