B23K 1/0016
Soldering of electronic components
Official title: {Soldering of electronic components}
B23K1/0016 (Soldering of electronic components) appears on 1,893 US grants and 2,384 published applications in this corpus.
Search patents in B23K- Granted patents
- 1,893
- Published applications
- 2,384
- Assignees
- 905
- Inventors
- 4,678
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 5 | 0 |
| 1993 | 15 | 0 |
| 1994 | 18 | 0 |
| 1995 | 11 | 0 |
| 1996 | 13 | 0 |
| 1997 | 15 | 0 |
| 1998 | 13 | 0 |
| 1999 | 12 | 0 |
| 2000 | 15 | 0 |
| 2001 | 16 | 10 |
| 2002 | 20 | 17 |
| 2003 | 15 | 23 |
| 2004 | 30 | 58 |
| 2005 | 28 | 51 |
| 2006 | 19 | 40 |
| 2007 | 20 | 36 |
| 2008 | 24 | 45 |
| 2009 | 24 | 80 |
| 2010 | 42 | 60 |
| 2011 | 45 | 103 |
| 2012 | 61 | 95 |
| 2013 | 57 | 102 |
| 2014 | 67 | 107 |
| 2015 | 102 | 220 |
| 2016 | 120 | 163 |
| 2017 | 171 | 191 |
| 2018 | 124 | 127 |
| 2019 | 120 | 126 |
| 2020 | 129 | 126 |
| 2021 | 105 | 103 |
| 2022 | 93 | 120 |
| 2023 | 98 | 123 |
| 2024 | 92 | 108 |
| 2025 | 81 | 100 |
| 2026 | 68 | 50 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Solder bump forming member, method for manufacturing solder bump forming member, and method for manufacturing electrode substrate provided with solder bump6 Oct 2026US 12,752,360 B2Resonac Corporation
- Electrically patterned polycrystalline diamond compact for sensing applications6 Oct 2026US 12,754,083 B2Schlumberger Technology Corporation
- Solder tack bonding of hard disk drive actuator arm assemblies6 Oct 2026US 12,755,757 B2Seagate Technology LLC
- Repair of solder bumps29 Sep 2026US 12,746,613 B2Orbotech Ltd.
- Network for controlling soldering systems and method therefor8 Sep 2026US 12,728,469 B2ERSA GmbH
- Improved cable connecting piece8 Oct 2026US 2026/0312306 A1Safetrack Infrasystems SISAB AB
- Non-magnetization modification source-containing paste, non-magnetization device, rotor core, and method for manufacturing the same1 Oct 2026US 2026/0295736 A1Honda Motor Co., Ltd.
- Semiconductor device substrate and method for producing semiconductor device substrate24 Sep 2026US 2026/0293676 A1NGK Insulators, Ltd.
- Solder tack bonding of hard disk drive actuator arm assemblies27 Aug 2026US 2026/0253610 A1Seagate Technology LLC
- Laser soldering apparatus having adjustable soldering position and soldering method comprising same20 Aug 2026US 2026/0241473 A1Laservall Technology Co., Ltd
Most cited
By later US patents
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Additive manufacturing of active devices using dielectric, conductive and magnetic materials323US 10,254,499 B1Southern Methodist University · 2019
- Wafer-to-wafer transfer of microstructures using break-away tethers240US 6,142,358 AThe Regents of the University of California · 2000
- Method for manufacturing raised electrical contact pattern of controlled geometry196US 6,215,670 B1FormFactor, Inc. · 2001
- Solder ball connect pad-on-via assembly process181US 5,275,330 AInternational Business Machines Corporation · 1994