Y10T 279/11
Vacuum
Y10T279/11 (Vacuum) appears on 278 US grants and 143 published applications in this corpus.
Search patents in Y10T- Granted patents
- 278
- Published applications
- 143
- Assignees
- 190
- Inventors
- 565
- Latest grant
- 7 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 3 | 0 |
| 1978 | 2 | 0 |
| 1979 | 3 | 0 |
| 1980 | 4 | 0 |
| 1981 | 4 | 0 |
| 1982 | 3 | 0 |
| 1983 | 5 | 0 |
| 1984 | 1 | 0 |
| 1985 | 5 | 0 |
| 1986 | 6 | 0 |
| 1987 | 4 | 0 |
| 1988 | 6 | 0 |
| 1989 | 9 | 0 |
| 1990 | 2 | 0 |
| 1991 | 3 | 0 |
| 1992 | 6 | 0 |
| 1993 | 5 | 0 |
| 1994 | 12 | 0 |
| 1995 | 9 | 0 |
| 1996 | 6 | 0 |
| 1997 | 7 | 0 |
| 1998 | 9 | 0 |
| 1999 | 13 | 0 |
| 2000 | 8 | 0 |
| 2001 | 12 | 1 |
| 2002 | 5 | 8 |
| 2003 | 7 | 9 |
| 2004 | 6 | 5 |
| 2005 | 4 | 9 |
| 2006 | 8 | 7 |
| 2007 | 5 | 6 |
| 2008 | 8 | 18 |
| 2009 | 8 | 6 |
| 2010 | 3 | 6 |
| 2011 | 6 | 8 |
| 2012 | 10 | 8 |
| 2013 | 6 | 10 |
| 2014 | 8 | 14 |
| 2015 | 9 | 10 |
| 2016 | 12 | 2 |
| 2017 | 6 | 3 |
| 2018 | 4 | 5 |
| 2019 | 5 | 2 |
| 2020 | 4 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 2 |
| 2023 | 0 | 0 |
| 2024 | 2 | 4 |
| 2025 | 0 | 0 |
| 2026 | 3 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Gripping device for holding, centring and/or collet-clamping a micromechanical or horological component7 Jul 2026US 12,673,373 B2ETA SA Manufacture Horlogere Suisse
- Gripping device for holding, centring and/or collet-clamping a micromechanical or horological component, and associated attachment method31 Mar 2026US 12,589,440 B2ETA SA Manufacture Horlogere Suisse
- Wafer processing apparatus and wafer processing method3 Mar 2026US 12,568,799 B2Zeus Co., Ltd.
- Wafer processing apparatus and wafer processing method27 Aug 2024US 12,074,054 B2Zeus Co., Ltd.
- Wafer processing apparatus and wafer processing method13 Feb 2024US 11,901,212 B2Zeus Co., Ltd.
- Adsorption device for reflow process and method of attaching connection bump using the same, and vacuum jig for semiconductor package26 Sep 2024US 2024/0321622 A1Samsung Electronics Co., Ltd.
- Gripping device for holding, centring and/or collet-clamping a micromechanical or horological component23 May 2024US 2024/0165714 A1ETA SA Manufacture Horlogere Suisse
- Gripping device for holding, centring and/or collet-clamping a micromechanical or horological component, and associated attachment method23 May 2024US 2024/0165715 A1ETA SA Manufacture Horlogere Suisse
- Wafer processing apparatus and wafer processing method1 Feb 2024US 2024/0038573 A1Zeus Co., Ltd.
- Wafer processing apparatus and wafer processing method3 Mar 2022US 2022/0068696 A1Zeus Co., Ltd.
Most cited
By later US patents
- Chucks and methods for positioning multiple objects on a substrate201US 5,788,814 ADavid Sarnoff Research Center, Inc. · 1998
- Vacuum fixture and method for fabricating electronic assemblies154US 5,546,654 AGeneral Electric Company · 1996
- Thin wafer chuck145US 8,336,188 B2FormFactor, Inc. · 2012
- Semiconductor wafer carrier and method119US 5,423,558 AIPEC/Westech Systems, Inc. · 1995
- Substrate holding apparatus112US 5,738,165 ANikon Corporation · 1998