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US 2022/0068696 A1Published application
Wafer processing apparatus and wafer processing method
AssigneeZeus Co., Ltd.
InventorsWoon KONG, Ji Hoon SONG, Ung Jo MOON, Ji Ho PARK
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Abstract
A wafer processing apparatus includes a vacuum chuck on which a wafer is seated, a ring cover disposed along a circumferential portion of the vacuum chuck to press the wafer to seal the circumferential portion of the vacuum chuck, and a sealing ring pressed against an adhesive sheet on the wafer and pressed by the ring cover.
Claims10
A wafer processing apparatus comprising:
- a vacuum chuck on which a wafer is seated;
- a ring cover disposed along a circumferential portion of the vacuum chuck to press the wafer to seal the circumferential portion of the vacuum chuck;
- and
- a sealing ring pressed against an adhesive sheet on the wafer and pressed by the ring cover.
1 more element
Dependencies are inferred from the claim text.