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US 11,901,212 B2Granted
Wafer processing apparatus and wafer processing method
AssigneeZeus Co., Ltd.
InventorsWoon Kong, Ji Hoon Song, Ung Jo Moon, Ji Ho Park, Won Seok Choi
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Abstract
A wafer processing apparatus includes a rotating chuck rotatably installed on a driver, a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated, a chuck module installed in the rotating chuck to fix the wafer to the vacuum chuck, and a moving module configured to move the vacuum chuck or the chuck module to increase a gap between adjacent dies of the wafer.
Claims12
A wafer processing apparatus comprising:
- a rotating chuck rotatably installed on a driver;
- a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated;
- a chuck module installed in the rotating chuck to fix the wafer to the vacuum chuck;
- and
- a moving module configured to move the vacuum chuck or the chuck module to increase a gap between adjacent dies of the wafer.
2 more elements
Dependencies are inferred from the claim text.