Vacuum fixture and method for fabricating electronic assemblies

A method for packaging an electronic component, comprising the steps of:

• positioning at least one electronic component having a face with connection pads face down on an insulative film;
• positioning the insulative film on a porous sheet supported by a vacuum fixture, the porous sheet and vacuum fixture for creating vacuum conditions for holding the insulative film with a substantially flat surface on the porous sheet;
• creating a vacuum for flatly holding the insulative film on the porous sheet;
• and
• applying a substrate to the insulative film and the at least one electronic component by
• providing a substrate having at least one well therein;
• and
• positioning the insulative film on at least a portion of the substrate and the at least one electronic component into the at least one well while maintaining the vacuum.

A method for packaging an electronic component comprising the steps of:

• attaching an insulative film to a frame;
• positioning the insulative film on a porous sheet supported by a vacuum fixture, the porous sheet and vacuum fixture for creating vacuum conditions for holding the insulative film with a substantially flat surface on the porous sheet;
• providing a substrate having at least one well therein;
• positioning at least one electronic component having a face with connection pads face up in the at least one well;
• creating a vacuum for flatly holding the insulative film on the porous sheet;
• and
• positioning the insulative film on the at least one electronic component and at least a portion of the substrate while maintaining the vacuum.

An apparatus for fabricating an electronic assembly, the apparatus comprising:

• a porous sheet;
• a vacuum fixture supporting the porous sheet, the porous sheet and vacuum fixture for creating vacuum conditions for holding an insulative film with a surface substantially flat on the porous sheet;
• and
• a mold form positioned over one portion of the vacuum fixture, the mold form having at least one opening for the addition of substrate molding material.