Adsorption device for reflow process and method of attaching connection bump using the same, and vacuum jig for semiconductor package
AssigneeSamsung Electronics Co., Ltd.
InventorYOUNG-JA KIM
Life of this patent
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Abstract
An adsorption device for a reflow process according to an embodiment is coupled to a semiconductor package to form a reflow assembly in a reflow process. The semiconductor package includes a substrate and a semiconductor chip disposed at one surface of the substrate. The adsorption device for the reflow process includes a main body and a pressure control member. The main body includes an inner space portion and includes a bottom portion and a substrate adsorption portion that protrudes from the bottom portion to be adhered to the one surface of the substrate in an outer region of the semiconductor chip by a negative pressure. The pressure control member maintains a pressure of the inner space portion.
Claims20
An adsorption device, comprising:
- a main body that includes an inner space portion, a bottom portion, and a substrate adsorption portion that protrudes from the bottom portion, wherein the substrate adsorption portion is configured to adhere to a first surface of a substrate by a negative pressure;
- and
- a pressure control member that maintains a pressure of the inner space portion.
A vacuum jig for a semiconductor package, comprising:
- a main body that includes an inner space portion and includes a bottom portion and a substrate adsorption portion protruding from the bottom portion, wherein the substrate adsorption portion includes one or more adsorption holes;
- and
- a vacuum control member configured to control a vacuum state of the inner space portion.
A method for forming a connection bump, comprising:
- forming a reflow assembly by coupling an adsorption device to a semiconductor package including a substrate and a semiconductor chip on a first surface of the substrate;
- forming the connection bump on a second surface of the substrate opposite the first surface;
- performing a reflow process of coupling the connection bump to the second surface of the substrate by applying heat to the connection bump;
- and
- separating the adsorption device from the semiconductor package,
- wherein in the forming of the reflow assembly, a substrate adsorption portion of the adsorption device is adhered to an outer region of the semiconductor chip on the first surface of the substrate.
Dependencies are inferred from the claim text.