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US 12,074,054 B2Granted
Wafer processing apparatus and wafer processing method
AssigneeZeus Co., Ltd.
InventorsWoon Kong, Ji Hoon Song, Ung Jo Moon, Ji Ho Park
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Abstract
A wafer processing apparatus includes a vacuum chuck on which a wafer is seated, a ring cover disposed along a circumferential portion of the vacuum chuck to press the wafer to seal the circumferential portion of the vacuum chuck, and a sealing ring pressed against an adhesive sheet on the wafer and pressed by the ring cover.
Claims8
A wafer processing apparatus comprising:
- a vacuum chuck on which a wafer is seated;
- a ring cover disposed along a circumferential portion of the vacuum chuck to press the wafer to seal the circumferential portion of the vacuum chuck;
- and
- a sealing ring pressed against an adhesive sheet on the wafer and pressed by the ring cover,
- wherein a deformation space is formed inside the sealing ring to allow the sealing ring to be deformed when the ring cover presses, and
- wherein a hook portion is formed on the vacuum chuck, and the hook portion confines the sealing ring to prevent the sealing ring from being separated from the vacuum chuck.
3 more elements
Dependencies are inferred from the claim text.