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US 12,568,799 B2Granted
Wafer processing apparatus and wafer processing method
AssigneeZeus Co., Ltd.
InventorsWoon Kong, Ji Hoon Song, Ung Jo Moon, Ji Ho Park, Won Seok Choi
Life of this patent
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Abstract
A wafer processing apparatus includes a rotating chuck rotatably installed on a driver, a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated, a chuck module installed in the rotating chuck to fix the wafer to the vacuum chuck, and a moving module configured to move the vacuum chuck or the chuck module to increase a gap between adjacent dies of the wafer.
Claims8
A wafer processing method comprising:
- mounting a wafer on a vacuum chuck;
- fixing, by a chuck module, the wafer to the vacuum chuck;
- moving, by a moving module, the vacuum chuck or the chuck module to increase a gap between adjacent dies of the wafer;
- and
- rotating a rotating chuck and the vacuum chuck while spraying a cleaning solution onto the wafer to remove foreign materials from the wafer.
2 more elements
A wafer processing method comprising:
- mounting a wafer on a vacuum chuck;
- arranging a ring cover on a circumferential portion of the vacuum chuck;
- fixing the wafer to the vacuum chuck and fixing the ring cover to a rotating chuck as a chuck module is moved;
- and
- rotating the rotating chuck and the vacuum chuck while spraying a supply solution onto the wafer to etch the wafer.
2 more elements
Dependencies are inferred from the claim text.