Y10S 438/974
Substrate surface preparation
Y10S438/974 (Substrate surface preparation) appears on 419 US grants and 124 published applications in this corpus.
Search patents in Y10S- Granted patents
- 419
- Published applications
- 124
- Assignees
- 173
- Inventors
- 735
- Latest grant
- 4 Jun 2019
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 2 | 0 |
| 1979 | 5 | 0 |
| 1980 | 3 | 0 |
| 1981 | 7 | 0 |
| 1982 | 3 | 0 |
| 1983 | 3 | 0 |
| 1984 | 1 | 0 |
| 1985 | 5 | 0 |
| 1986 | 4 | 0 |
| 1987 | 3 | 0 |
| 1988 | 6 | 0 |
| 1989 | 10 | 0 |
| 1990 | 6 | 0 |
| 1991 | 8 | 0 |
| 1992 | 3 | 0 |
| 1993 | 13 | 0 |
| 1994 | 17 | 0 |
| 1995 | 17 | 0 |
| 1996 | 24 | 0 |
| 1997 | 16 | 0 |
| 1998 | 28 | 0 |
| 1999 | 31 | 0 |
| 2000 | 30 | 0 |
| 2001 | 22 | 9 |
| 2002 | 24 | 16 |
| 2003 | 30 | 20 |
| 2004 | 12 | 11 |
| 2005 | 9 | 8 |
| 2006 | 15 | 13 |
| 2007 | 6 | 10 |
| 2008 | 12 | 8 |
| 2009 | 5 | 6 |
| 2010 | 10 | 5 |
| 2011 | 10 | 3 |
| 2012 | 3 | 4 |
| 2013 | 1 | 1 |
| 2014 | 2 | 5 |
| 2015 | 6 | 2 |
| 2016 | 2 | 3 |
| 2017 | 1 | 0 |
| 2018 | 0 | 0 |
| 2019 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Method for low temperature bonding and bonded structure4 Jun 2019US 10,312,217 B2Invensas Bonding Technologies, Inc.
- Semiconductor device having a field-effect structure and a nitrogen concentration profile29 Aug 2017US 9,748,374 B2Infineon Technologies AG
- Method for low temperature bonding and bonded structure12 Jul 2016US 9,391,143 B2Ziptronix, Inc.
- Method for low temperature bonding and bonded structure3 May 2016US 9,331,149 B2Ziptronix, Inc.
- Controlled process and resulting device13 Oct 2015US 9,159,605 B2Silicon Genesis Corporation
- Integrated Circuit On Corrugated Substrate8 Dec 2016US 2016/0359006 A1Synopsys, Inc.
- Method for low temperature bonding and bonded structure3 Nov 2016US 2016/0322328 A1Ziptronix, Inc.
- Method for low temperature bonding and bonded structure24 Mar 2016US 2016/0086913 A1Ziptronix, Inc.
- Method for low temperature bonding and bonded structure22 Oct 2015US 2015/0303263 A1Ziptronix, Inc.
- Semiconductor Device having a Field-Effect Structure6 Aug 2015US 2015/0221766 A1Infineon Technologies AG
Most cited
By later US patents
- Atomic layer epitaxy (ALE) apparatus for growing thin films of elemental semiconductors721US 5,281,274 AThe United States of America as represented by the Secretary of the Navy · 1994
- Apparatus for and a method of growing thin films of elemental semiconductors671US 5,225,366 AThe United States of America as represented by the Secretary of the Navy · 1993
- Method of forming a metal oxide dielectric446US 7,326,656 B2Intel Corporation · 2008
- Controlled cleavage process and device for patterned films426US 5,985,742 ASilicon Genesis Corporation · 1999
- Surface treatment for silicon substrates423US 5,510,277 AAT&T Corp. · 1996