Y10S 228/904
Wire bonding
Y10S228/904 (Wire bonding) appears on 115 US grants and 40 published applications in this corpus.
Search patents in Y10S- Granted patents
- 115
- Published applications
- 40
- Assignees
- 56
- Inventors
- 177
- Latest grant
- 7 Apr 2015
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 8 | 0 |
| 1978 | 9 | 0 |
| 1979 | 2 | 0 |
| 1980 | 4 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 3 | 0 |
| 1990 | 3 | 0 |
| 1991 | 3 | 0 |
| 1992 | 6 | 0 |
| 1993 | 0 | 0 |
| 1994 | 3 | 0 |
| 1995 | 6 | 0 |
| 1996 | 5 | 0 |
| 1997 | 2 | 0 |
| 1998 | 4 | 0 |
| 1999 | 1 | 0 |
| 2000 | 6 | 0 |
| 2001 | 1 | 0 |
| 2002 | 2 | 3 |
| 2003 | 1 | 0 |
| 2004 | 0 | 4 |
| 2005 | 3 | 5 |
| 2006 | 2 | 2 |
| 2007 | 2 | 6 |
| 2008 | 2 | 6 |
| 2009 | 8 | 4 |
| 2010 | 6 | 2 |
| 2011 | 6 | 4 |
| 2012 | 5 | 2 |
| 2013 | 0 | 1 |
| 2014 | 1 | 0 |
| 2015 | 1 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Wire loop forming systems and methods of using the same7 Apr 2015US 8,998,063 B2Orthodyne Electronics Corporation
- Method of manufacturing semiconductor device, and wire bonder11 Nov 2014US 8,881,966 B2Renesas Electronics Corporation
- Wire bonding apparatus with a textured capillary surface enabling high-speed wedge bonding of wire bonds18 Sep 2012US 8,267,303 B2National Semiconductor Corporation
- Dual capillary IC wirebonding24 Jul 2012US 8,225,982 B2Texas Instruments Incorporated
- Electrical bond connection system22 May 2012US 8,181,845 B2Robert Bosch GmbH
- Wire loop forming systems and methods of using the same28 May 2015US 2015/0144682 A1Orthodyne Electronics Corporation
- Wire loop forming systems and methods of using the same8 Aug 2013US 2013/0200134 A1Orthodyne Electronics Corporation
- Wire bonding method and capillary enabling high-speed wedge bonding of wire bonds9 Feb 2012US 2012/0031955 A1National Semiconductor Corporation
- Conductive bumps, wire loops, and methods of forming the same12 Jan 2012US 2012/0006882 A1Kulicke and Soffa Industries, Inc.
- Dual Capillary IC Wirebonding10 Nov 2011US 2011/0272449 A1Texas Instruments Incorporated
Most cited
By later US patents
- Concave face wire bond capillary139US 6,158,647 AMicron Technology, Inc. · 2000
- Wire loop, semiconductor device having same, wire bonding method and wire bonding apparatus125US 6,933,608 B2Kaijo Corporation · 2005
- Wire bonding method125US 7,621,436 B2Kabushiki Kaisha Shinkawa · 2009
- Concave face wire bond capillary113US 6,439,450 B1Micron Technology, Inc. · 2002
- Wire loop, semiconductor device having same, wire bonding method and wire bonding apparatus111US 7,262,124 B2Kaijo Corporation · 2007