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US 8,998,063 B2Granted
Wire loop forming systems and methods of using the same
AssigneeOrthodyne Electronics Corporation
InventorJonathan Michael Byars
Life of this patent
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Abstract
A wire bonding system is provided. The system includes a bond head, a bonding tool carried by the bond head, a wire supply configured for bonding by the bonding tool, and a wire shaping tool carried by the bond head. The wire shaping tool is independently moveable with respect to the bond head and the bonding tool.
Claims17
A wire bonding system, comprising:
- a bond head;
- a bonding tool carried by the bond head;
- a wire supply configured for bonding by the bonding tool;
- a wire shaping tool carried by the bond head, the wire shaping tool being independently moveable with respect to the bonding tool;
- and
- a probe driver for driving the wire shaping tool, wherein the probe driver includes a lever arm attached to the wire shaping tool and affixed to a linearly actuated push rod.
3 more elements
Dependencies are inferred from the claim text.