Conductive bumps, wire loops, and methods of forming the same
AssigneeKulicke and Soffa Industries, Inc.
InventorGary S. Gillotti
Life of this patent
Estimating the term…
Abstract
A method of forming a conductive bump is provided. The method includes the steps of: (1) bonding a free air ball to a bonding location using a bonding tool to form a bonded ball; (2) raising the bonding tool to a desired height, with a wire clamp open, while paying out wire continuous with the bonded ball; (3) closing the wire clamp; (4) lowering the bonding tool to a smoothing height with the wire clamp still closed; (5) smoothing an upper surface of the bonded ball, with the wire clamp still closed, using the bonding tool; and (6) raising the bonding tool, with the wire clamp still closed, to separate the bonded ball from wire engaged with the bonding tool.
Claims51
A method of forming a conductive bump, the method comprising the steps of:
- (1) bonding a free air ball to a bonding location using a bonding tool to form a bonded ball;
- (2) raising the bonding tool to a desired height, with a wire clamp open, while paying out wire continuous with the bonded ball;
- (3) closing the wire clamp;
- (4) lowering the bonding tool to a smoothing height with the wire clamp still closed;
- (5) smoothing an upper surface of the bonded ball, with the wire clamp still closed, using the bonding tool;
- and
- (6) raising the bonding tool, with the wire clamp still closed, to separate the bonded ball from wire engaged with the bonding tool.
A method of forming a wire loop comprising the steps of:
- (1) forming a conductive bump on a bonding location, the step of forming the conductive bump including:
- (a) bonding a free air ball to a bonding location using a bonding tool to form a bonded ball;
- (b) raising the bonding tool to a desired height, with a wire clamp open, while paying out wire continuous with the bonded ball;
- (c) closing the wire clamp;
- (d) lowering the bonding tool to a smoothing height with the wire clamp still closed;
- (e) smoothing an upper surface of the bonded ball, with the wire clamp still closed, using the bonding tool;
- and
- (f) raising the bonding tool, with the wire clamp still closed, to separate the bonded ball from wire engaged with the bonding tool, thereby forming a conductive bump on the bonding location;
- (2) bonding a portion of wire to another bonding location using the bonding tool;
- (3) extending a length of wire from the bonded portion of wire to the conductive bump;
- and
- (4) bonding an end of the length of wire to the conductive bump.
Dependencies are inferred from the claim text.