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US 2013/0200134 A1Published application
Wire loop forming systems and methods of using the same
AssigneeOrthodyne Electronics Corporation
InventorJonathan Michael Byars
Life of this patent
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Abstract
A wire bonding system is provided. The system includes a bond head, a bonding tool carried by the bond head, a wire supply configured for bonding by the bonding tool, and a wire shaping tool carried by the bond head. The wire shaping tool is independently moveable with respect to the bond head and the bonding tool.
Claims28
A wire bonding system, comprising:
- a bond head;
- a bonding tool carried by the bond head;
- a wire supply configured for bonding by the bonding tool;
- and
- a wire shaping tool carried by the bond head, the wire shaping tool being independently moveable with respect to the bond head and the bonding tool.
2 more elements
A method of forming a wire loop comprising the steps of:
- a) bonding a first portion of a wire from a wire supply to a first bonding location of a substrate using a wire bonding tool carried by a bond head;
- b) extending the wire from the first bonding location to an elevated position above the first bonding location;
- c) shaping a second portion of the wire proximate the elevated position to form a bend using a wire shaping tool carried by the bond head and moveable with respect to the bond head and the wire bonding tool;
- d) extending the wire to a second bonding location of the substrate;
- and
- e) bonding a third portion of the wire to the second bonding location using the wire bonding tool.
3 more elements
Dependencies are inferred from the claim text.