Wire bonding apparatus with a textured capillary surface enabling high-speed wedge bonding of wire bonds

A wire bonding apparatus comprising:

• a support for holding wire bonding substrates;
• a wire bonding capillary with an aperture for carrying and extruding bond wire and enabling bond wire attachment to wire bonding substrates;
• a movable deflector element arranged to move generally adjacent to a facing surface of the capillary to bend an extruded length of bonding wire such that the bent extruded length of bonding wire can be articulated at different bond line angles while maintaining a constant rotational orientation for the capillary;
• wherein the movable deflector element having an aperture comprising a center with an inner surface of the aperture arranged concentrically about the center further including a plurality of wire guide features to assist positioning of the extruded length of bonding wire wherein a first wire guide feature comprises a recessed portion that lies a greater radial distance from the center of the aperture than a remaining portion of the inner surface of the aperture;
• and wherein the capillary comprises a facing surface that includes at least one of a roughened matte surface arranged on the facing surface, a pattern of intersecting ridges forming a criss-crossed pattern arranged on the facing surface, and a series of ridges arranged on the facing surface;
• and
• a controller configured to enable control the operation of the wire bonding apparatus.