Y10S 228/00
Metal fusion bonding
Y10S228/00 (Metal fusion bonding) appears on 250 US grants and 66 published applications in this corpus.
Search patents in Y10S- Granted patents
- 250
- Published applications
- 66
- Assignees
- 134
- Inventors
- 447
- Latest grant
- 9 Jan 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 9 | 0 |
| 1977 | 14 | 0 |
| 1978 | 14 | 0 |
| 1979 | 2 | 0 |
| 1980 | 6 | 0 |
| 1981 | 0 | 0 |
| 1982 | 4 | 0 |
| 1983 | 5 | 0 |
| 1984 | 5 | 0 |
| 1985 | 7 | 0 |
| 1986 | 10 | 0 |
| 1987 | 4 | 0 |
| 1988 | 5 | 0 |
| 1989 | 8 | 0 |
| 1990 | 6 | 0 |
| 1991 | 11 | 0 |
| 1992 | 9 | 0 |
| 1993 | 6 | 0 |
| 1994 | 6 | 0 |
| 1995 | 12 | 0 |
| 1996 | 7 | 0 |
| 1997 | 3 | 0 |
| 1998 | 6 | 0 |
| 1999 | 7 | 0 |
| 2000 | 7 | 0 |
| 2001 | 8 | 3 |
| 2002 | 11 | 4 |
| 2003 | 4 | 1 |
| 2004 | 2 | 12 |
| 2005 | 4 | 6 |
| 2006 | 5 | 2 |
| 2007 | 3 | 7 |
| 2008 | 3 | 8 |
| 2009 | 9 | 6 |
| 2010 | 6 | 3 |
| 2011 | 8 | 5 |
| 2012 | 8 | 4 |
| 2013 | 1 | 1 |
| 2014 | 2 | 2 |
| 2015 | 2 | 1 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 1 |
| 2022 | 0 | 0 |
| 2023 | 0 | 0 |
| 2024 | 1 | 0 |
By publication year. Applications have been published since 2001.
Subgroups
Granted patents
Recent patents
- Method for forming non-bonded regions in multi-layered metallic armor9 Jan 2024US 11,865,809 B2The Boeing Company
- Wire loop forming systems and methods of using the same7 Apr 2015US 8,998,063 B2Orthodyne Electronics Corporation
- Automated brazing system24 Feb 2015US 8,960,522 B2Carrier Corporation
- Method for bonding refractory ceramic and metal2 Dec 2014US 8,899,470 B2Corning Incorporated
- Method of manufacturing semiconductor device, and wire bonder11 Nov 2014US 8,881,966 B2Renesas Electronics Corporation
- Method and apparatus for forming non-bonded regions in multi-layered metallic armor8 Apr 2021US 2021/0101365 A1The Boeing Company
- Wire loop forming systems and methods of using the same28 May 2015US 2015/0144682 A1Orthodyne Electronics Corporation
- Bonded refractory ceramic and metal article13 Nov 2014US 2014/0331718 A1Corning Incorporated
- Automated brazing system27 Mar 2014US 2014/0084043 A1Carrier Corporation
- Wire loop forming systems and methods of using the same8 Aug 2013US 2013/0200134 A1Orthodyne Electronics Corporation
Most cited
By later US patents
- Concave face wire bond capillary139US 6,158,647 AMicron Technology, Inc. · 2000
- Direct bonding of metals to ceramics and metals132US 3,994,430 AGeneral Electric Company · 1976
- Wire loop, semiconductor device having same, wire bonding method and wire bonding apparatus125US 6,933,608 B2Kaijo Corporation · 2005
- Wire bonding method125US 7,621,436 B2Kabushiki Kaisha Shinkawa · 2009
- Concave face wire bond capillary113US 6,439,450 B1Micron Technology, Inc. · 2002